@inproceedings{2017-5,

title = {Effect of 3D Stack-Up Integration on Through Silicon Via Characteristics},

author = {David Dahl and Ivan Ndip and Klaus-Dieter Lang and Christian Schuster},

doi = {10.1109/SaPIW.2017.7944025},

year  = {2017},

date = {2017-10-07},

urldate = {2017-10-07},

address = {Lake Maggiore (Baveno), Italy, May 7-10},

organization = {IEEE Workshop on Signal and Power Integrity (SPI),},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2017-6,

title = {Exploration of Differential Via Stub Effect Mitigation by Using PAM4 and PAM8 Line Coding},

author = {Katharina Scharff and Torsten Reuschel and Xiaomin Duan and Heinz-Dietrich Brüns and Christian Schuster},

doi = {10.1109/SaPIW.2017.7944020},

year  = {2017},

date = {2017-05-07},

urldate = {2017-05-07},

address = {Lake Maggiore (Baveno), Italy, May 7-10},

organization = {IEEE Workshop on Signal and Power Integrity (SPI),},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2017-7,

title = {Efficient Design of Continuous Time Linear Equalization for Loss Dominated Digital Links},

author = {Torsten Reuschel and Jan Birger Preibisch and Christian Schuster},

doi = {10.1109/SaPIW.2017.7943999},

year  = {2017},

date = {2017-05-07},

urldate = {2017-05-07},

address = {Lake Maggiore (Baveno), Italy, May 7-10},

organization = {IEEE Workshop on Signal and Power Integrity (SPI), },

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2017-3,

title = {Simulation-Based Validation of Near Field Communication Effects on Aircraft Wiring},

author = {Jan Philip Speichert and Thorsten Kiehl and Ralf God and Heinz-Dietrich Brüns and Christian Schuster},

year  = {2017},

date = {2017-02-21},

urldate = {2017-02-21},

address = {Hamburg, Germany, February 21–22},

organization = {International Workshop on Aircraft System Technologies (AST),},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2017-2,

title = {Redundant and Non-Redundant Spectrum Shaping Schemes for Reflection-Limited Chip-to-Chip Communication},

year  = {2017},

date = {2017-02-06},

address = { Hamburg, Germany, February 6-9},

organization = {International ITG Conference on Systems, Communication and Coding (SCC),},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2017-12,

title = {Redundant and Non-Redundant Spectrum Shaping Schemes for Reflection-Limited Chip-to-Chip Communication},

author = {Yu Zhao and Rainer Grünheid and Gerhard Bauch and Torsten Reuschel and Christian Schuster},

year  = {2017},

date = {2017-02-06},

address = { Hamburg, Germany, February 6-9},

organization = {International ITG Conference on Systems, Communication and Coding (SCC) },

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2017-1,

title = {Exploring Efficient Variability-Aware Analysis Method for High-Speed Digital Link Design Using PCE},

author = {Jan Birger Preibisch and Jayaprakash Balachandran and Torsten Reuschel and Katharina Scharff and Bidyut Sen and Christian Schuster},

year  = {2017},

date = {2017-01-31},

address = {Santa Clara, CA, USA, January 31 – February 2},

organization = {UBM DesignCon Conference,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{nokey,

title = {Variability Analysis of via Crosstalk using Polynomial Chaos Expansion},

author = {Jan Birger Preibisch and Jayaprakash Balachandran and Torsten Reuschel and Katharina Scharff and Bidyut Sen and Christian Schuster},

doi = {10.1109/NEMO.2017.7964272},

year  = {2017},

date = {2017-01-31},

urldate = {2017-01-31},

organization = {UBM DesignCon Conference, Santa Clara, CA, USA, January 31-February 2,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2016-3,

title = {Evaluation of Vector Fitting for Compact Interconnect Model Representation},

author = {Luis Ernesto Carrera-Retana and Renato Rimolo-Donadio and Christian Schuster},

doi = {10.1109/CONCAPAN.2016.7942356},

year  = {2016},

date = {2016-11-09},

address = {San Jose, Costa Rica},

organization = {IEEE Convention of Central America and Panama Region (CONCAPAN)},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2016-13,

title = {Modeling of Differential Striplines in Segmented Simulation of Printed Circuit Board Link},

author = {Torsten Reuschel and Miroslav Kotzev and David Dahl and Christian Schuster},

doi = {10.1109/ISEMC.2016.7571772},

year  = {2016},

date = {2016-07-25},

journal = {IEEE Transactions on Antennas and Propagation},

address = {Ottawa, ON, Canada, July 25-29},

organization = {IEEE Signal and Power Integrity Conference (SIPI 2016),},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2016-13b,

title = {Design Space Exploration for Printed Circuit Board Vias Using Polynomial Chaos Expansion},

author = {Jan Birger Preibisch and Piero Triverio and Christian Schuster},

doi = {10.1109/ISEMC.2016.7571754},

year  = {2016},

date = {2016-06-25},

address = {Ottawa, ON, Canada, July 25-29},

organization = {IEEE Signal and Power Integrity Conference (SIPI) 2016,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2016-14,

title = {High Frequency Characterization of Silicon Substrate and through Silicon Vias},

author = {Xiaomin Duan and Mathias Boettcher and David Dahl and Christian Schuster and Christian Tschoban and Ivan Ndip and Klaus-Dieter Lang},

doi = {10.1109/ECTC.2016.240},

year  = {2016},

date = {2016-05-31},

address = { Las Vegas, US, May 31 – June 3},

organization = {Electronic Components and Technology Conference (ECTC),},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2016-15,

title = {Evaluation of isolation between blade antennas in pre-design phase using a synthesized model},

author = {Qi Wu and Heinz-Dietrich Brüns and Christian Schuster},

doi = {10.1109/APEMC.2016.7522883},

year  = {2016},

date = {2016-05-18},

address = {Shenzhen, China, May 18-21},

organization = {IEEE Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), },

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2016-16,

title = {Design Aspects for HIRF Protection of a Rectangular Metallic Cavity Using Energy Selective Diode Grids},

author = {Cheng Yang and Peiguo Liu and Heinz-Dietrich Brüns and Christian Schuster},

doi = { 10.1109/APEMC.2016.7522736},

year  = {2016},

date = {2016-05-18},

address = { Shenzhen, China, May 18-21},

organization = {IEEE Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC),},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}