Best Poster Award for Til Hillebrecht, Johannes Alfert, Torsten Reuschel and Christian Schuster for the conference contribution “Automated Generation and Correlation of Physics-Based Via Models with Full-Wave Simulation for an SI/PI Database,” presented at the 32st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Milpitas, CA, USA, Oct. 15-18, 2023.

DesignCon 2023 Early-Career Best Paper Award for Morten Schierholz, Ihsan Erdin (Celestica Inc.), Jayaprakash Balachandran(Cisco Inc.),  and Christan Schuster for the conference contribution “Data-Efficient Supervised Machine Learning Technique for Practical PCB Noise Decoupling”.

Best Bachelor Thesis of the Year Award for Malte Thode (2022)

Presented by the IEEE Germany Section EMC Society Chapter for the Ph.D. Thesis “Near-field Prediction of Coils for Wireless Power Transfer using Gaussian Process Regression”. Mr. Thode can be seen on the right in the picture. PDF

Certificate of Appreciation for Prof. Schuster for outstanding activities as the Chair of the German IEEE EMC Chapter (2021). Term of office was April 2016 till December 2019.

Presented by IEEE Electromagnetic Compatibility Society.

Best Paper Award for Lei Wang, Michael Wulff, Cheng Yang, Woocheon Park und Prof. Christian Schuster.

Presented by IEEE Antennas and Propagation Society for the conference contribution “ Numerical Investigation of OAM Based Indoor Communication in a Corridor with Electrical Conducting Walls” on the 5^th International Conference on UK China Emerging Technologies, Glasgow, United Kingdom, August 2020.

Best Ph.D. Thesis of the Year Award for Torsten Reuschel (2019).

Presented by the IEEE Germany Section EMC Society Chapter for the Ph.D. Thesis “Combined Assessment of Interconnect and Equalization in Data Links on Multilayer Printed Circuit Boards”.

Prof. Schuster is elected to the Board of Directors of the Electromagnetic Compatibility (EMC) Society of the Institute of Electrical and Electronics Engineers (IEEE). His term is January 2020 to December 2022.

Sustained Service to the EMC Society Award for Prof. Christian Schuster (2019).

Presented by the IEEE Electromagnetic Compability Society at the IEEE International Symposium on EMC in New Orleans, July 2019.

Best Student Paper Award for Katharina Scharff at the SPI (2018).

Presented by IEEE Electromagnetic Compatibility Society and the IEEE Transactions on Components, Packaging and Manufacturing Technology Society for the conference contribution “Physical Scaling Effects of Differential Crosstalk in Via Arrays up to Frequencies of 100 GHz on the 22nd IEEE Workshop on Signal and Power and Integrity.

Certificate of Recognition for Dr.-Ing. Heinz-Dietrich Brüns for outstanding contributions to the development and validation of electromagnetic simulation tools for EMC applications.

Presented by IEEE Electromagnetic Compability Society. PDF

DesignCon 2018 Best Paper Award for Torsten Reuschel, Ömer Yildiz, Jayaprakash Balachandran(Cisco Systems Inc.), Christian Filip (Mentor Graphics Inc.), Nitan Bhagwath(Mentor Graphics Inc.), Bidyut Sen(Cisco Systems Inc.) and Christan Schuster.

iWAT 2018 Best Poster Award for Lei Wang (TUHH, Germany), Jose Luis Gomez-Tornero (UPCT, Spain), and Oscar Quevedo-Teruel (KTH, Sweden).Awarded by the Committee of the 2018 international Workshop on Antenna Technology (IWAT 2018) for the contribution “Dispersion Reduced SIW Leaky-wave Antenna by Loading Metasurface Prism”. PDF

Best Master Thesis of the Year Award for Ömer Faruk Yildiz (2017).

Presented by the IEEE Germany Section EMC Society Chapter for the Master Thesis “Analysis of Electromagnetic Interference Variability on RF Integrated Circuits”. PDF

EPEPS Best Poster Award for Luis Ernesto Carrera-Retana (ITCR), Renato Rimolo-Donadio (ITCR), and Christian Schuster (2017).

Awarded by the Technical Program Committee of the IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) for the contribution “Evaluation of Concatenation Techniques for State-Space Interconnect Macromodels”.

Certificate of Appreciation for Prof. Schuster for outstanding service 2015 as a member of the IEEE EMC Society Board of Directors (2016).

Presented by IEEE Electromagnetic Compatibility Society

2016 IEEE Transactions on Components, Packaging and Manufacturing Technology Best Paper Award – Electrical Performance of lntegrated Systems Category for David Dahl, Torsten Reuschel, Jan Birger Preibisch, Xiaomin Duan, Ivan Ndip, Klaus-Dieter Lang, and Christian Schuster.

Presented by the IEEE Components, Packaging and Manufacturing Technology Society for the paper entitled “Efficient Total Crosstalk Analysis of Large Via Arrays in Silicon Interposers”. PDF

DesignCon Paper Award for Jan Preibisch, Torsten Reuschel, Katharina Scharff, Jayaprakash Balachandran (Cisco), Bidyut Sen (Cisco) and Christian Schuster (2017).
Presented by the Technical Program Committee of DesignCon for the conference contribution „Exploring Efficient Variability-aware Analysis Method for High-Speed Digital Link Design Using PCE“.

IEEE EMC Germany Award for Alexander Vogt for the best PhD thesis of the year 2016.

Presented by IEEE Electromagnetic Compatibility Society – German Chapter – for his PhD thesis “Analysis of Electromagnetic Interference n Server Casings.” PDF

Prof. Schuster is elected Chair by the German Chapter of the Electromagnetic Compatibility (EMC) Society of the Institute of Electrical and Electronics Engineers (IEEE). His term starts April 2016 and ends December 2019.

Third Prize Award for Jan Birger
Preibisch at the NEMO Conference (2015)

Presented by the Interational Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO) of the IEEE MTT-Society for participation in the student paper competition with the contribution “Efficient Stochastic Transmission Line Modeling Using Polynomial Chaos Expansion with Multiple Variables”.

Prof. Schuster is invited to become a member of the international advisory board of the International Electromagnetic Proficiency Test (iEMPT) program of National Taiwan University (2015).

Richard Schulz Transactions Prize Paper Award (2015)

Presented by the IEEE Electromagnetic Compatibility Society as co-author for the contribution “Analysis of High Intensity Radiated Field Coupling into Aircraft Using the Method of Moments”.

Prof. Schuster is appointed to the Board of Directors of the IEEE EMC Society (2015).
Dr. Robert Scully, President of the IEEE Electromagnetic Compatbility (EMC) Society, appoints Prof. Schuster as a voting member to the Board of Directors for the year 2015.

Best Master Thesis of the Year Award for Jan Birger Preibisch (2014).

Presented by the IEEE Germany Section EMC Society Chapter for the Master Thesis “Feasibility of Two-Dimensional Photonic Crystal Modeling Using the Contour Integral Method”.

Certificate of Appreciation for Prof. Schuster for outstanding service as an EMC Distinguished Lecturer for the term 2012-2013 (2014).

Presented by IEEE Electromagnetic Compatibility Society.

Best Student Paper Award for David Dahl at the SPI (2014).

Presented by IEEE Electromagnetic Compatibility Society and the IEEE Transactions on Components, Packaging and Manufacturing Technology Society for the conference contribution “Analysis of Wave Propagation along Coaxial Through Silicon Vias Using a Matrix Method”. PDF

Best Student Paper Award for Alexander Vogt at the APEMC (2013).

Presented by IEEE Electromagnetic Compatibility Society for the conference contribution “Modeling Absorbing Materials in Cavities with Apertures Using the Thin Sheet Approximation”. PDF

Best IEEE Transactions on Components, Packaging and Manufacturing Technology Best Paper Award for Xiaomin Duan (2012)

Presented by the IEEE Transactions on Components, Packaging and Manufacturing Technology – Electrical Performance of lntegrated Systems Category- for the journal contribution “Extension of the Contour Integral Method to Anisotropie Modes on Circular Ports”.PDF

First Runner Up Paper Award for Alexander Vogt at the EMC Symposium (2012).

Presented by IEEE Electromagnetic Compatibility Society for the conference contribution “Applicability of the Thin Sheet Approximation to the Analysis of EM Emission from Coated PCBs “.PDF

Best Paper Award of the EMV Düsseldorf trade show and congress for Arne Schröder, Heinz-Dietrich Brüns und Christian Schuster (2012).

Presented by the program committee of EMV Düsseldorf for the presentation “Beschleunigung schneller Löser in der Momentenmethode bei
Einkopplungsproblemen mit Mehrfachanregung”.PDF

Certificate of Appreciation for Prof. Schuster for outstanding contributions to the development of IEEE Standard 1597.2-2010 Recommended Practice for Validation of Computational Electromagnetics Computer Modeling and Simulations (2011).

Presented by IEEE Standards Association.

IEEE EMC Germany Award for Renato Rimolo-Donadio for the best PhD thesis of the year 2010/2011.Presented by IEEE Electromagnetic Compatibility Society – German Chapter – for his PhD thesis “Development, Validation, and Application of Semi-analytical Interconnect Models for Efficient Simulation of Multilayer Substrates.”PDF

“Award for exceptional commitment for students” for Prof. Christian Schuster (2010).

Presented by the Fachschaftsrat ET/IT of TUHH. PDF

TUHH Diploma Award for Sebastian Müller (2010).

Presented by the Foundation for the Advancement of TUHH for the diploma thesis “Including multiconductor transmission lines in a quasi-analytical model for multilayer structures “.PDF

IBM Ph.D. Fellowship Award (2010).

Presented by IBM Corporate Technology, Universtity Relations for his outstandig work as Ph.D. student in the field of signal and power integrity of digital systems.PDF

IBM Faculty Award for Christian Schuster (2010).

Presented by the IBM Corporate Technology, Universtity Relations for outstanding work in the field of “Combined Analysis and Optimization of Signal and Power Integrity for High-Speed Server Systems”.

Design Con Paper Award for Renato-Rimolo-Donadio, Christian Schuster and co-workers (2010)

Presented by the IEC for the presentation “Fast Physics-Based Via and Trace Models for Signal and Power Integrity Co-Analysis”.

IBM Faculty Award for Christian Schuster (2009).

Presented by the IBM Management and Business Support GmbH for outstanding work in the field of “Multi-Port Calibartion, Measurement, and Modeling of Differential Data Buses and other High-Speed Digital Interconnects”.

Best Student Symposium Paper Award for Xiaomin Duan (2009).

Presented by the IEEE Electromagnetic Compatibility Society for the conference contribution “EM Emission of Differential Signals Across Connected Printed Circuit Boards in the GHz Range”.

Best Bachelor Thesis of the Year Award for Sebastian Müller (2008).

Presented by the German Chapter of the IEEE Electromagnetic Compatibility Society for the Bachelor thesis
“Korrektur und Erweiterung eines Programmes zur Berechnung von Leitungsparametern auf der Grundlage der 2D-Momentenmethode
mit flächigen Ersatzladungen”.

Design, Automation, and Test in Europe Best interactive Presentation Award for Renato Rimolo-Donadio, Christian Schuster and co-workers (2008).

Presented by the DATE conference organization for the poster contribution “Analysis and Optimization of the Recessed Probe Launch for High Frequency Measurements of PCB Interconnects”.

DesignCon Paper Award for Christian Schuster and co-workers (2006).

Presented by the ICE for the conference contribution “Developing a ‘Physical’ Model for Vias”.

Best IEEE Transactions on Electromagnetic Compatibility Paper Award for Christian Schuster and co-workers (2001).

Presented by the IEEE Electromagnetic Compatibility Society for the journal contribution “Parasitic Modes on Printed Circuit Boards and Their Effect on EMC and Signal Integrity”.