Electromagnetic Compatibility II:
Signal Integrity and Power Supply of Electronic Systems

Prof. Christian Schuster, Winter Term, in German or English

Students learn to explain the fundamental principles, inter-dependencies, and methods of signal and power integrity of electronic systems. They are able to relate signal and power integrity to the context of interference-free design of such systems, i.e. their electromagnetic compatibility. They are capable of explaining the basic behavior of signals and power supply in typical packages and interconnects. They are able to propose and describe problem solving strategies for signal and power integrity issues. They are capable of giving an overview over measurement and simulation methods for characterization of signal and power integrity in electrical engineering practice.

Specifically students learn to apply a series of modeling methods for characterization of electromagnetic field behavior in packages and interconnect structure of electronic systems. They are able to determine the most important effects that these models are predicting in terms of signal and power integrity. They can classify these effects and they can quantitatively analyze them. They are capable of deriving problem solving strategies from these predictions and they can adapt them to applications in electrical engineering practice. The can evaluate their problem solving strategies against each other.

Further Information:

Link to Module Description