The SI/PI-Database is a collection of printed circuit board (PCB) based structures which represent different electromagnetic aspects for signal integrity and power integrity applications. The structures have different components and interconnecting elements e.g. vias, via-arrays, power, ground planes. Each structures contains many variations of geometry and material parameters along with the simulation results. All structures were simulated with a physics-based approach which was cross validated with a full-wave solver for different structures.
Physics-Based Approach related publications:
An overview of the structures is given in the following table along with the simulated frequency range, variations of the geometry and materials and a general description of the structure. The structure explanation has all necessary information to rebuild the setup and verify the simulation results. Additionally classification labels are explained if available.
The SI/PI-Database is intended to help the development of machine learning tools and techniques for signal integrity, power integrity and electromagnetic compatibility applications. Without the need to create the data for the machine learning investigations a performance boost during the development of the techniques should be observed.
Any usage of the data of the SI/PI-Database has to be referenced to the following article:
M. SCHIERHOLZ, A. SANCHEZ-MASIS, A. CARMONA-CRUZ, X. DUAN, K. ROY, C. YANG, R. RIMOLO-DONADIO, C. SCHUSTER,
“SI/PI-Database of PCB-Based Interconnects for Machine Learning Applications”,
IEEE Access, vol. 9, pp. 34423-34432, 2021.
To get access to the data please fill out the contact form at the bottom. The download link will be provided by the entered e-mail address. You will receive an e-mail within 24 hours under normal circumstances with a download link for a zip-archive. The zip-archive contains multiple files. The description of the structure with the parameter variations is explained. A file which has all parameter variations along with classification labels and the simulation index (simu_index). The scattering parameters for the according simulation file is found by the (simu_index) . For each parameter variation with the a touchstone file simu_index.sNp is available.
Further benchmark problems related to electronic packaging are available in The Packaging Benchmark Suite by IEEE Electronics Packaging Society (EPS) Technical Committee on Electrical Design, Modeling and Simulation (TC-EDMS).