Publikationen

341 Einträge « 1 von 14 »

2022

Marco de Stafano, Torben Wendt, Stefano Grivet-Talocia, Cheng Yang, Christian Schuster

A Waveform Relaxation Solver for Transient Simulation of Large-Scale Nonlinearly Loaded Shielding Structures Artikel

In: IEEE Transactions on Electromagnetic Compatibility, pp. 1-13, 2022.

Links

Hamideh Esmaeili, Cheng Yang, Christian Schuster

Flexible Numerical Evaluation of Human Head Exposure to a Transmitter Coil for Wireless Power Transfer at 13.56MHz Konferenzbeitrag

In: IEEE International Symposium on Electromagnetic Compatibility - EMC Europe, Gothenburg, Sweden, September 05-08, 2022.

Links

Michael Wulff, Lei Wang, Cheng Yang, Christian Schuster

Inter Mode Interference in Circular Antenna Arrays for Orbital Angular Momentum (OAM) Based Communication Konferenzbeitrag

In: IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Denver, USA, July 10-15, 2022.

Links

Michael Wulff, Woocheon Park, Lei Wang, Cheng Yang, Heinz-Dietrich Brüns, Christian Schuster

Shielding of Orbital Angular Momentum Waves by a Cavity With Apertures Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 3, pp. 692-701 , 2022.

Links

Marco de Stafano, Torben Wendt, Cheng Yang, Stefano Grivet-Talocia, Christian Schuster

Regularized and Compressed Large-Scale Rational Macromodeling: Theory and Application to Energy-Selective Shielding Enclosures Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 5, pp. 1365-1379, 2022.

Links

Torben Wendt, Cheng Yang, Christian Schuster

Signal Integrity Assessment of External ESD Protection for Gbits/s Data Rates on Ceramic Test Fixture Konferenzbeitrag

In: IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25, 2022. 2022.

Links

Christian Morten Schierholz, Ihsan Erdin, Jayaprakash Balachandran, Cheng Yang, Christian Schuster

Parametric S-Parameters for PCB based Power Delivery Network Design Using Machine Learning Konferenzbeitrag

In: IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25, 2022.

Links

Michael Wulff, Lei Wang, Cheng Yang, Christian Schuster

Effect of the Orientation of the Array Elements of Uniform Circular Antenna Arrays on Orbital Angular Momentum (OAM) Modes Konferenzbeitrag

In: German Microwave Conference (GeMiC), Ulm, Germany, May 16 -18, 2022, ISSN: 2167-8022 .

Katharina Scharff

Evaluation of Interconnects up to 100 GHz Using Machine Learning Promotionsarbeit

2022, ISBN: 978-3-8440-8534-1.

Torben Wendt, and Marco de Stefano, Cheng Yang, Stefano Grivet-Talocia, Christian Schuster

Iteration Dependent Waveform Relaxation for Hybrid Field Nonlinear Circuit Problems Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 4, pp. 1124-1139, 2022.

Links

Luis Ernesto Carrera-Retana, Mario Marin-Sanchez, Christian Schuster, Renato Rimolo-Donadio

Improving Accuracy After Stability Enforcement in the Loewner Matrix Framework Artikel

In: IEEE Transaction on Microwave Theory and Techniques, vol. 70, no. 2, pp.1037-1047, 2022.

Links

Michael Wulff, Till Hillebrecht, Lei Wang, Cheng Yang, Christian Schuster

Multiconductor Transmission Lines for Orbital Angular Momentum (OAM) Communication Links Artikel

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 2, pp. 329-340, 2022.

Links

2021

Cheng Yang, Torben Wendt, and Marco de Stefano, Marc Kopf, Christopher Marc Becker, Stefano Grivet-Talocia, Christian Schuster

Analysis and Optimization of Nonlinear Diode Grids for Shielding of Enclosures With Apertures," Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 63, no. 6, pp. 1884-1895, 2021.

Links

Torben Wendt, Cheng Yang, and Marco de Stefano, Stefano Grivet-Talocia, Christian Schuster

Distributed Nonlinear Shielding in Power Delivery Networks on Printed Circuit Boards Konferenzbeitrag

In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), virtual event, Austin, TX, USA, October 17-20, 2021.

Links

Christian Morten Schierholz, Youcef Hassab, Christian Schuster

Evaluation of Support Vector Machines for PCB based Power Delivery Network Classification Konferenzbeitrag

In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), virtual event, Austin, TX, USA, October 17-20, 2021.

Links

Ömer Faruk Yildiz, Nico Pathè, Marc Bochard, Cheng Yang, Christian Schuster

Introducing Functional Via Structures to Low Temperature Cofired Ceramics: How to Optimize Reliably and Efficiently Artikel

In: IEEE Electromagnetic Compatibility Magazine, vol. 10, no. 4, pp. 35-45, 2021.

Links

Allan Sanchesz-Masis, Allan Carmona-Cruz, Christian Morten Schierholz, Xiaomin Duan, Troy J. Beukema, Cheng Yang, Renato Rimolo-Donadio, Christian Schuster

ANN Hyperparameter Optimization by Genetic Algorithms for Via Interconnect Classification Konferenzbeitrag

In: IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12, 2021.

Links

Cheng Yang, Christian Morten Schierholz, Eileen Trunczik, Leon Maximilian Helmich, Heinz-Dietrich Brüns, Christian Schuster

Efficient and Flexible Huygens’ Source Replacement of mm-scale Human Brain Implants Konferenzbeitrag

In: Joint IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (EMCS+SIPI) and Symposium on EMC Europe (EMC Europe), virtual event, Glasgow, Scotland, July 26 - August 20, 2021.

Links

Ömer Faruk Yildiz, Nico Pathè, Marc Bochard, Cheng Yang, Christian Schuster

Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics Konferenzbeitrag

In: IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12, 2021.

Links

Lei Wang, Michael Wulff, Cheng Yang, Christian Schuster

Numerical Analysis of Two MIMO Channels Carrying Orbital Angular Momentum (OAM) Konferenzbeitrag

In: European Conference on Antennas and Propagation (EuCAP), virtual event, Düsseldorf, Germany, March 22-26, 2021.

Links

Ömer Faruk Yildiz, Ole Thomsen, Marc Bochard, Cheng Yang, Christian Schuster

Vertical Integration of Passive Microwave Components Using Functional Via Structures in LTCC Multilayer Substrates Artikel

In: IEEE Transactions of Components, Packaging and Manufacturing Technology, vol. 11, no. 4, pp. 635-646, 2021.

Links

Harry Weber, Harun Baran, Fabian Utermöhlen, Christian Schuster

Macromodeling of Mutual Inductance for Displaced Coils Based on Laplace’s Equation Artikel

In: IEEE Transactions on Instrumantation and Measurement, vol. 70, 2021.

Links

Marco de Stafano, Stefano Grivet-Talocia, Torben Wendt, Cheng Yang, Christian Schuster

A Multistage Adaptive Sampling Scheme for Passivity Characterization of Large-Scale Macromodels Artikel

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 3, pp. 471-484, 2021.

Links

Christian Morten Schierholz, Allan Sanchesz-Masis, Allan Carmona-Cruz, Xiaomin Duan, Kallol Roy, Cheng Yang, Renato Rimolo-Donadio, Christian Schuster

SI/PI-Database of PCB-Based Interconnects for Machine Learning Applications Artikel

In: IEEE Access, vol. 9, pp. 34423-34432, 2021.

Links

Ömer Faruk Yildiz, Ole Thomsen, Cheng Yang, Christian Schuster

Vertically Integrated Microwave-Filters Using Functional Via Structures in LTCC Konferenzbeitrag

In: European Microwave Conference (EuMC), virtual event, Utrecht, Netherlands, Jan. 12-14, 2021.

Links

341 Einträge « 1 von 14 »