Publikationen

300 Einträge « 1 von 12 »

2021

Cheng Yang, Christian Morten Schierholz, Eileen Trunczik, Leon Maximilian Helmich, Heinz-Dietrich Brüns, Christian Schuster

Efficient and Flexible Huygens’ Source Replacement of mm-scale Human Brain Implants Konferenzbericht

2021.

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Cheng Yang, Torben Wendt, and Marco de Stefano, Marc Kopf, Christopher Marc Becker, Stefano Grivet-Talocia, Christian Schuster

Analysis and Optimization of Nonlinear Diode Grids for Shielding of Enclosures With Apertures," Artikel

In: IEEE Transactions on Electromagnetic Compatibility, S. 1 - 12, 2021.

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Ömer Faruk Yildiz, Ole Thomsen, Marc Bochard, Cheng Yang, Christian Schuster

Vertical Integration of Passive Microwave Components Using Functional Via Structures in LTCC Multilayer Substrates Artikel

In: IEEE Transactions of Components, Packaging and Manufacturing Technology, Volume 11 (4), S. 635 - 646, 2021.

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Harry Weber, Harun Baran, Fabian Utermöhlen, Christian Schuster

Macromodeling of Mutual Inductance for Displaced Coils Based on Laplace’s Equation Artikel

In: IEEE Transactions on Instrumantation and Measurement, 70 , 2021.

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Marco de Stafano, Stefano Grivet-Talocia, Torben Wendt, Cheng Yang, Christian Schuster

A Multistage Adaptive Sampling Scheme for Passivity Characterization of Large-Scale Macromodels Artikel

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 , S. 471-484, 2021.

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Christian Morten Schierholz, Allan Sanchesz-Masis, Allan Carmona-Cruz, Xiaomin Duan, Kallol Roy, Cheng Yang, Renato Rimolo-Donadio, Christian Schuster

SI/PI-Database of PCB-Based Interconnects for Machine Learning Applications Artikel

In: 2021, ISSN: 2169-3536 .

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Ömer Faruk Yildiz, Ole Thomsen, Cheng Yang, Christian Schuster

Vertically Integrated Microwave-Filters Using Functional Via Structures in LTCC Konferenzbeitrag

In: 50th European Microwave Conference (EuMC) Utrecht, Netherlands , 2021.

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2020

Katharina Scharff, Christian Morten Schierholz, Cheng Yang, Christian Schuster

ANN Performance for the Prediction of High-Speed Digital Interconnects over Multiple PCBs Konferenzbeitrag

In: IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) San Jose, CA, USA, 2020.

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Lei Wang, Woocheon Park, Cheng Yang, Heinz-Dietrich Brüns, Dong Gun Kam, Christian Schuster

Wireless Communication of Radio Waves Carrying Orbital Angular Momentum (OAM) Above an Infinite Ground Plane Artikel

In: IEEE Transactions on Electromagnetic Compatibility, 62 , S. 2257-2264, 2020.

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Katharina Scharff, Hakki M. Torun, Cheng Yang, Madhavan Swaminathan, Christian Schuster

Bayesian Optimization for Signal Transmission Including Crosstalk in a Via Array Konferenzbeitrag

In: International Symposium on Electromagnetic Compatibility, Georgia Institut of technology, Atlanta, 2020.

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Lei Wang, Michael Wulff, Cheng Yang, Woocheon Park, Christian Schuster

Numerical Investigation of OAM Based Indoor Communication in a Corridor with Electrical Conducting Walls Konferenzbeitrag

In: 5th International Conference on UK–China Emerging Technologies (UCET) August, 20, 2020.

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Torben Wendt, Cheng Yang, Heinz-Dietrich Brüns, Stefano Grivet-Talocia, Christian Schuster

A Macromodeling-Based Hybrid Method for the Computation of Transient Electromagnetic Fields Scattered by Nonlinearly Loaded Metal Structures Publisher: IEEE PDF Artikel

In: IEEE Transactions on Electromagnetic Compatibility , S. 1-13, 2020.

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Christian Morten Schierholz, Cheng Yang, Kallol Roy, Madhavan Swaminathan, Christian Schuster

Comparison of Collaborative versus Extended Artificial Neural Networks for PDN Design Konferenzbeitrag

In: 24th IEEE Workshop on Signal and Power Intergrity (SPI) Cologne, Germany, May 17-20, 2020.

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Michael Wulff, Lei Wang, Cheng Yang, Heinz-Dietrich Brüns, Christian Schuster

Using Orbital Angular Momentum (OAM) Modes on Multi-Conductor Cables for Crosstalk Mitigation Konferenzbeitrag

In: 24th IEEE Workshop on Signal and Power Integrity, Cologne, Germany, May 17-20, 2020.

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2019

Ömer Faruk Yildiz, Christian Schuster

Design of Wideband Functional Via Structures for LTCC Multilayer Substrates up to 110 GHz Konferenzbeitrag

In: IEEE Electrical Design of Advanced Package & Systems Symposium (EDAPS) Bangalore, Kaohsiung, Taiwan, December 16-18, 2019.

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Katharina Scharff, Heinz-Dietrich Brüns, Christian Schuster

Efficient Crosstalk Analysis of Differential Links on Printed Circuit Boards Up to 100 GHz Artikel

In: IEEE Transactions on Electromagnetic Compatibility, 61 (6), 2019.

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Christian Morten Schierholz, Katharina Scharff, Christian Schuster

Evaluation of Neural Networks to Predict Target Impedance Violations of Power Delivery Networks Konferenzbeitrag

In: IEEE Conference on Electrical Perfomance of Electronic Packaging and Systems (EPEPS) Montreal, Canada, October 6-9, 2019.

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Torben Wendt, Cheng Yang, Christian Schuster, Stefano Grivet-Talocia

Numerical complexity study of solving hybrid multiport field-circuit problems for diode grids Konferenzbeitrag

In: 2019 International Conference on Electromagnetics in Advanced Applications (ICEAA) Granada, Spain, 2019.

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Lei Wang, Heinz-Dietrich Brüns, Christian Schuster

Effect of the interference from conducting plates on OAM based wireless communication Konferenzbeitrag

In: 2019 International Conference on Electromagnetics in Advanced Applications (ICEAA), Granada, Spain, 2019.

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David Dahl, Heinz-Dietrich Brüns, Lei Wang, Eduard Frick, Christian Seifert, Marko Lindner, Christian Schuster

Efficient Simulation of Substrate-Integrated Waveguide Antennas Using a Hybrid Boundary Element Method Artikel

In: IEEE Journal on Multiscale and Multiphysics Computational Techniques, 4 , 2019.

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Jonathan Cedeno-Chaves, Katharina Scharff, Allan Carmona-Cruz, Heinz-Dietrich Brüns, Renato Rimolo-Donadio, Christian Schuster

Mode Conversion Due To Residual Via Stubs in Differential Signaling Konferenzbeitrag

In: IEEE Workshop on Signal and Power Integrity (SPI) Chambery, France, June 18-21, 2019.

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Katharina Scharff, Heinz-Dietrich Brüns, Christian Schuster

Performance Metrics for Crosstalk on Printed Circuit Boards in Frequency Domain Konferenzbeitrag

In: 2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI), 2019.

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Allan Carmona-Cruz, Katharina Scharff, Jonathan Cedeno-Chaves, Heinz-Dietrich Brüns, Renato Rimolo-Donadio, Christian Schuster

Via Transition Optimization Using a Domain Decomposition Approach Konferenzbeitrag

In: 2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) Chambery, France, June 18-21, 2019.

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Till Hillebrecht, David Dahl, Christian Schuster

Prediction of Frequency Dependent Shielding Behavior for Ground Via Fences in Printed Circuit Boards Konferenzbeitrag

In: 2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) Chambery, France, June 18-21, 2019.

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Zhongkui Wen, Qi Wu, Ömer Faruk Yildiz, Christian Schuster

Design of Experiments for Analyzing the Efficiency of a Multi-Coil Wireless Power Transfer System Using Polynomial Chaos Expansion" Konferenzbeitrag

In: 2019 Joint International Symposium on Electromagnetic Compatibility Sapporo, Japan, 3-7 June, 2019.

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300 Einträge « 1 von 12 »