Publikationen

361 Einträge « 1 von 15 »

2023

Allan Sanchesz-Masis, Renato Rimolo-Donadio, Kallol Roy, Modar Sulaiman, Christian Schuster

FNNs Models for Regression of S-Parameters in Multilayer Interconnects with Different Electrical Lengths Proceedings Article

In: 2023 IEEE MTT-S Latin America Microwave Conference (LAMC), San José, Costa Rica, December 06-08, 2023.

Links

Michael Wulff, Lei Wang, Alexander Koelpin, Christian Schuster

Influence of the Communication Environment on Orbital Angular Momentum (OAM) Mode Orthogonality Proceedings Article

In: European Microwave Conference (EuMC), Berlin, Germany, September 19-21, 2023.

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Til Hillebrecht und Johannes Alfert, Torsten Reuschel

Automated Generation and Correlation of Physics-Based Via Models with Full-Wave Simulation for an SI/PI Database Proceedings Article

In: Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Milpitas, CA, USA, October 15-18, 2023.

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Hamideh Esmaeili, Cheng Yang, Christian Schuster

Physics Inspired Artificial Neural Network Adaptation for SAR Prediction in Bio-EM Problems Proceedings Article

In: The 2023 International Microwave Biomedical Conference, Leuven, Belgium, September 11-13, 2023.

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Federico Garbuglia, Torsten Reuschel, Christian Schuster, Dirk Deschrijver, Tom Dhaene, Domenico Spina

Modeling Electrically Long Interconnects Using Physics-Informed Delayed Gaussian Processes Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 65, no. 6, pp. 1715 - 1723, 2023.

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Cheng Yang, Christian Adam, Sebastian Götschel

Single-probe Near-field Phase Retrieval using On-The-Fly Scan and Hilbert Transform Proceedings Article

In: EMC Europe 2023, Krakow, Poland, September 04-08, 2023.

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Luis Ernesto Carrera-Retana, Mario Marin-Sanchez, Christian Schuster, Renato Rimolo-Donadio

Construction of Reciprocal Macromodels in the Loewner Matrix Framework Artikel

In: IEEE Transactions on Microwave Theory and Techniques, vol. 71, no. 8, pp. 3561-3571, 2023.

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Michael Wulff, Tong Zhang, Lei Wang, Heinz-Dietrich Brüns, Christian Schuster

Simulating Aperture Coupling of OAM Waves Through an Infinite PEC Plane Using EFIE-MoM Part I Validation and Numerical Accuracy Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 65, no. 5, pp. 1389-1399, 2023.

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Michael Wulff, Lei Wang, Heinz-Dietrich Brüns, Christian Schuster

Simulating Aperture Coupling of OAM Waves Through an Infinite PEC Plane Using EFIE-MoM Part II Application and Interpretation Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 65, no. 5, pp. 1400-1409, 2023.

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Christian Morten Schierholz, Youcef Hassab, Christian Schuster

Engineering-Informed Design Space Reduction for PCB Based Power Delivery Networks Artikel

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 13, no. 10, pp. 1613 - 1623, 2023.

Links

Torben Wendt

Hybrid Simulation of Multiport Structures for Diode Based Shielding Applications Promotionsarbeit

2023, ISBN: 978-3-8440-9129-8.

Hamideh Esmaeili, Cheng Yang, Christian Schuster

SAR Prediction in Human Head Tissues with Varying Material Parameters Using an Artificial Neural Network Proceedings Article

In: Annual Conference of BioEM, Oxford, United Kingdom, June 18-24, 2023.

Lennart Bohl, Katharina Scharff, Xiaomin Duan, Christian Schuster

Bayesian Optimization of First-Order Continuous-Time Linear Equalization in High-Speed Links Including Crosstalk Proceedings Article

In: IEEE Workshop on Signal and Power Integrity (SPI), Aveiro, Portugal, May 07-10, 2023.

Links

Federico Garbuglia, Domenico Spina, Torsten Reuschel, Christian Schuster, Dirk Deschrijver, Tom Dhaene

Modeling S-parameters of Interconnects using Periodic Gaussian Process Kernels Proceedings Article

In: IEEE Workshop on Signal and Power Integrity (SPI), Aveiro, Portugal, May 07-10, 2023.

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Jose Enrique Hernandez-Bonilla, Golzar Alavi, Cheng Yang, Christian Schuster

Measurement of Temperature and Humidity Dependance of Automotive-Grade Interconnects Proceedings Article

In: IEEE Workshop on Signal and Power Integrity (SPI), Aveiro, Portugal, May 07-10, 2023.

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Ömer Faruk Yildiz

Functional Via Structures in Passive Microwave Components on Multilayer Ceramic Substrates Promotionsarbeit

2023, ISBN: 978-3-8440-9002-4.

Christian Morten Schierholz, Ihsan Erdin, Jayaprakash Balachandran, Christian Schuster

Data-Efficient Supervised Machine Learning Technique for Practical PCB Noise Decoupling Proceedings Article

In: DesignCon 2023 Early-Career, Santa Clara, CA, USA, January 30 - February 1, 2023.

2022

Marco de Stafano, Torben Wendt, Stefano Grivet-Talocia, Cheng Yang, Christian Schuster

A Waveform Relaxation Solver for Transient Simulation of Large-Scale Nonlinearly Loaded Shielding Structures Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 6, pp. 2042 - 2054, 2022.

Links

Hamideh Esmaeili, Cheng Yang, Christian Schuster

Flexible Numerical Evaluation of Human Head Exposure to a Transmitter Coil for Wireless Power Transfer at 13.56MHz Proceedings Article

In: IEEE International Symposium on Electromagnetic Compatibility - EMC Europe, Gothenburg, Sweden, September 05-08, 2022.

Links

Michael Wulff, Lei Wang, Cheng Yang, Christian Schuster

Inter Mode Interference in Circular Antenna Arrays for Orbital Angular Momentum (OAM) Based Communication Proceedings Article

In: IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Denver, USA, July 10-15, 2022.

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Michael Wulff, Woocheon Park, Lei Wang, Cheng Yang, Heinz-Dietrich Brüns, Christian Schuster

Shielding of Orbital Angular Momentum Waves by a Cavity With Apertures Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 3, pp. 692-701 , 2022.

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Marco de Stafano, Torben Wendt, Cheng Yang, Stefano Grivet-Talocia, Christian Schuster

Regularized and Compressed Large-Scale Rational Macromodeling: Theory and Application to Energy-Selective Shielding Enclosures Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 5, pp. 1365-1379, 2022.

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Christian Morten Schierholz, Ihsan Erdin, Jayaprakash Balachandran, Cheng Yang, Christian Schuster

Parametric S-Parameters for PCB based Power Delivery Network Design Using Machine Learning Proceedings Article

In: IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25, 2022.

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Torben Wendt, Cheng Yang, Christian Schuster

Signal Integrity Assessment of External ESD Protection for Gbits/s Data Rates on Ceramic Test Fixture Proceedings Article

In: IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25, 2022. 2022.

Links

Michael Wulff, Lei Wang, Cheng Yang, Christian Schuster

Effect of the Orientation of the Array Elements of Uniform Circular Antenna Arrays on Orbital Angular Momentum (OAM) Modes Proceedings Article

In: German Microwave Conference (GeMiC), Ulm, Germany, May 16 -18, 2022, ISSN: 2167-8022 .

361 Einträge « 1 von 15 »