Publikationen

312 Einträge « 1 von 13 »

2022

Torben Wendt, Cheng Yang, Christian Schuster

Signal Integrity Assessment of External ESD Protection for Gbits/s Data Rates on Ceramic Test Fixture Konferenzbeitrag

In: IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25, 2022. 2022.

Christian Morten Schierholz, Ihsan Erdin, Jayaprakash Balachandran, Cheng Yang, Christian Schuster

Parametric S-Parameters for PCB based Power Delivery Network Design Using Machine Learning Konferenzbeitrag

In: IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25, 2022.

Katharina Scharff

Evaluation of Interconnects up to 100 GHz Using Machine Learning Promotionsarbeit

2022, ISBN: 978-3-8440-8534-1.

Luis Ernesto Carrera-Retana, Mario Marin-Sanchez, Christian Schuster, Renato Rimolo-Donadio

Improving Accuracy After Stability Enforcement in the Loewner Matrix Framework Artikel

In: IEEE Transaction on Microwave Theory and Techniques, vol. 70, no. 2, pp.1037-1047, 2022.

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Michael Wulff, Till Hillebrecht, Lei Wang, Cheng Yang, Christian Schuster

Multiconductor Transmission Lines for Orbital Angular Momentum (OAM) Communication Links Artikel

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 2, pp. 329-340, 2022.

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2021

Cheng Yang, Torben Wendt, and Marco de Stefano, Marc Kopf, Christopher Marc Becker, Stefano Grivet-Talocia, Christian Schuster

Analysis and Optimization of Nonlinear Diode Grids for Shielding of Enclosures With Apertures," Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 63, no. 6, pp. 1884-1895, 2021.

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Torben Wendt, Cheng Yang, and Marco de Stefano, Stefano Grivet-Talocia, Christian Schuster

Distributed Nonlinear Shielding in Power Delivery Networks on Printed Circuit Boards Konferenzbeitrag

In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), virtual event, Austin, TX, USA, October 17-20, 2021.

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Christian Morten Schierholz, Youcef Hassab, Christian Schuster

Evaluation of Support Vector Machines for PCB based Power Delivery Network Classification Konferenzbeitrag

In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), virtual event, Austin, TX, USA, October 17-20, 2021.

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Ömer Faruk Yildiz, Nico Pathè, Marc Bochard, Cheng Yang, Christian Schuster

Introducing Functional Via Structures to Low Temperature Cofired Ceramics: How to Optimize Reliably and Efficiently Artikel

In: IEEE Electromagnetic Compatibility Magazine, vol. 10, no. 4, pp. 35-45, 2021.

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Allan Sanchesz-Masis, Allan Carmona-Cruz, Christian Morten Schierholz, Xiaomin Duan, Troy J. Beukema, Cheng Yang, Renato Rimolo-Donadio, Christian Schuster

ANN Hyperparameter Optimization by Genetic Algorithms for Via Interconnect Classification Konferenzbeitrag

In: IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12, 2021.

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Cheng Yang, Christian Morten Schierholz, Eileen Trunczik, Leon Maximilian Helmich, Heinz-Dietrich Brüns, Christian Schuster

Efficient and Flexible Huygens’ Source Replacement of mm-scale Human Brain Implants Konferenzbeitrag

In: Joint IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (EMCS+SIPI) and Symposium on EMC Europe (EMC Europe), virtual event, Glasgow, Scotland, July 26 - August 20, 2021.

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Ömer Faruk Yildiz, Nico Pathè, Marc Bochard, Cheng Yang, Christian Schuster

Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics Konferenzbeitrag

In: IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12, 2021.

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Lei Wang, Michael Wulff, Cheng Yang, Christian Schuster

Numerical Analysis of Two MIMO Channels Carrying Orbital Angular Momentum (OAM) Konferenzbeitrag

In: European Conference on Antennas and Propagation (EuCAP), virtual event, Düsseldorf, Germany, March 22-26, 2021.

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Ömer Faruk Yildiz, Ole Thomsen, Marc Bochard, Cheng Yang, Christian Schuster

Vertical Integration of Passive Microwave Components Using Functional Via Structures in LTCC Multilayer Substrates Artikel

In: IEEE Transactions of Components, Packaging and Manufacturing Technology, vol. 11, no. 4, pp. 635-646, 2021.

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Harry Weber, Harun Baran, Fabian Utermöhlen, Christian Schuster

Macromodeling of Mutual Inductance for Displaced Coils Based on Laplace’s Equation Artikel

In: IEEE Transactions on Instrumantation and Measurement, vol. 70, 2021.

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Marco de Stafano, Stefano Grivet-Talocia, Torben Wendt, Cheng Yang, Christian Schuster

A Multistage Adaptive Sampling Scheme for Passivity Characterization of Large-Scale Macromodels Artikel

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 3, pp. 471-484, 2021.

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Christian Morten Schierholz, Allan Sanchesz-Masis, Allan Carmona-Cruz, Xiaomin Duan, Kallol Roy, Cheng Yang, Renato Rimolo-Donadio, Christian Schuster

SI/PI-Database of PCB-Based Interconnects for Machine Learning Applications Artikel

In: IEEE Access, vol. 9, pp. 34423-34432, 2021.

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Ömer Faruk Yildiz, Ole Thomsen, Cheng Yang, Christian Schuster

Vertically Integrated Microwave-Filters Using Functional Via Structures in LTCC Konferenzbeitrag

In: European Microwave Conference (EuMC), virtual event, Utrecht, Netherlands, Jan. 12-14, 2021.

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2020

Katharina Scharff, Christian Morten Schierholz, Cheng Yang, Christian Schuster

ANN Performance for the Prediction of High-Speed Digital Interconnects over Multiple PCBs Konferenzbeitrag

In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) San Jose, CA, USA, 2020.

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Lei Wang, Woocheon Park, Cheng Yang, Heinz-Dietrich Brüns, Dong Gun Kam, Christian Schuster

Wireless Communication of Radio Waves Carrying Orbital Angular Momentum (OAM) Above an Infinite Ground Plane Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 62, no. 5, pp. 2257-2264, 2020.

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Katharina Scharff, Hakki M. Torun, Cheng Yang, Madhavan Swaminathan, Christian Schuster

Bayesian Optimization for Signal Transmission Including Crosstalk in a Via Array Konferenzbeitrag

In: International Symposium on Electromagnetic Compatibility, Rome, Italy, Sept. 23-25, 2020.

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Lei Wang, Michael Wulff, Cheng Yang, Woocheon Park, Christian Schuster

Numerical Investigation of OAM Based Indoor Communication in a Corridor with Electrical Conducting Walls Konferenzbeitrag

In: International Conference on UK–China Emerging Technologies (UCET) August, 20, 2020.

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Torben Wendt, Cheng Yang, Heinz-Dietrich Brüns, Stefano Grivet-Talocia, Christian Schuster

A Macromodeling-Based Hybrid Method for the Computation of Transient Electromagnetic Fields Scattered by Nonlinearly Loaded Metal Structures Artikel

In: IEEE Transactions on Electromagnetic Compatibility, vol. 62, no. 4, pp. 1098-1110, 2020.

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Michael Wulff, Lei Wang, Cheng Yang, Heinz-Dietrich Brüns, Christian Schuster

Using Orbital Angular Momentum (OAM) Modes on Multi-Conductor Cables for Crosstalk Mitigation Konferenzbeitrag

In: IEEE Workshop on Signal and Power Integrity, Cologne, Germany, May 17-20, 2020.

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Christian Morten Schierholz, Cheng Yang, Kallol Roy, Madhavan Swaminathan, Christian Schuster

Comparison of Collaborative versus Extended Artificial Neural Networks for PDN Design Konferenzbeitrag

In: IEEE Workshop on Signal and Power Intergrity (SPI) Cologne, Germany, May 17-20, 2020.

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312 Einträge « 1 von 13 »