Publikationen
2022
Signal Integrity Assessment of External ESD Protection for Gbits/s Data Rates on Ceramic Test Fixture Konferenzbeitrag
In: IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25, 2022. 2022.
Parametric S-Parameters for PCB based Power Delivery Network Design Using Machine Learning Konferenzbeitrag
In: IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25, 2022.
Evaluation of Interconnects up to 100 GHz Using Machine Learning Promotionsarbeit
2022, ISBN: 978-3-8440-8534-1.
Improving Accuracy After Stability Enforcement in the Loewner Matrix Framework Artikel
In: IEEE Transaction on Microwave Theory and Techniques, vol. 70, no. 2, pp.1037-1047, 2022.
Multiconductor Transmission Lines for Orbital Angular Momentum (OAM) Communication Links Artikel
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 2, pp. 329-340, 2022.
2021
Analysis and Optimization of Nonlinear Diode Grids for Shielding of Enclosures With Apertures," Artikel
In: IEEE Transactions on Electromagnetic Compatibility, vol. 63, no. 6, pp. 1884-1895, 2021.
Distributed Nonlinear Shielding in Power Delivery Networks on Printed Circuit Boards Konferenzbeitrag
In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), virtual event, Austin, TX, USA, October 17-20, 2021.
Evaluation of Support Vector Machines for PCB based Power Delivery Network Classification Konferenzbeitrag
In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), virtual event, Austin, TX, USA, October 17-20, 2021.
In: IEEE Electromagnetic Compatibility Magazine, vol. 10, no. 4, pp. 35-45, 2021.
ANN Hyperparameter Optimization by Genetic Algorithms for Via Interconnect Classification Konferenzbeitrag
In: IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12, 2021.
Efficient and Flexible Huygens’ Source Replacement of mm-scale Human Brain Implants Konferenzbeitrag
In: Joint IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (EMCS+SIPI) and Symposium on EMC Europe (EMC Europe), virtual event, Glasgow, Scotland, July 26 - August 20, 2021.
Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics Konferenzbeitrag
In: IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12, 2021.
Numerical Analysis of Two MIMO Channels Carrying Orbital Angular Momentum (OAM) Konferenzbeitrag
In: European Conference on Antennas and Propagation (EuCAP), virtual event, Düsseldorf, Germany, March 22-26, 2021.
In: IEEE Transactions of Components, Packaging and Manufacturing Technology, vol. 11, no. 4, pp. 635-646, 2021.
Macromodeling of Mutual Inductance for Displaced Coils Based on Laplace’s Equation Artikel
In: IEEE Transactions on Instrumantation and Measurement, vol. 70, 2021.
A Multistage Adaptive Sampling Scheme for Passivity Characterization of Large-Scale Macromodels Artikel
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 3, pp. 471-484, 2021.
SI/PI-Database of PCB-Based Interconnects for Machine Learning Applications Artikel
In: IEEE Access, vol. 9, pp. 34423-34432, 2021.
Vertically Integrated Microwave-Filters Using Functional Via Structures in LTCC Konferenzbeitrag
In: European Microwave Conference (EuMC), virtual event, Utrecht, Netherlands, Jan. 12-14, 2021.
2020
ANN Performance for the Prediction of High-Speed Digital Interconnects over Multiple PCBs Konferenzbeitrag
In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) San Jose, CA, USA, 2020.
In: IEEE Transactions on Electromagnetic Compatibility, vol. 62, no. 5, pp. 2257-2264, 2020.
Bayesian Optimization for Signal Transmission Including Crosstalk in a Via Array Konferenzbeitrag
In: International Symposium on Electromagnetic Compatibility, Rome, Italy, Sept. 23-25, 2020.
Numerical Investigation of OAM Based Indoor Communication in a Corridor with Electrical Conducting Walls Konferenzbeitrag
In: International Conference on UK–China Emerging Technologies (UCET) August, 20, 2020.
In: IEEE Transactions on Electromagnetic Compatibility, vol. 62, no. 4, pp. 1098-1110, 2020.
Using Orbital Angular Momentum (OAM) Modes on Multi-Conductor Cables for Crosstalk Mitigation Konferenzbeitrag
In: IEEE Workshop on Signal and Power Integrity, Cologne, Germany, May 17-20, 2020.
Comparison of Collaborative versus Extended Artificial Neural Networks for PDN Design Konferenzbeitrag
In: IEEE Workshop on Signal and Power Intergrity (SPI) Cologne, Germany, May 17-20, 2020.