New Research Highlight: Bridging Machine Learning and PCB Design!
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Machine Learning has enormous potential to accelerate innovation in the Signal and Power Integrity domains — but it’s only as effective as the data it’s trained on. 📊⚡

Our latest work, titled „Unified Pre-Processing Steps Reducing the PCB Design Space to Enable ML Applications for Signal and Power Integrity Analysis“, addresses a core challenge: How can we reduce the vast, complex PCB design space into a set of meaningful configurations for ML applications and provide the data in a ready-to-use format?

In this paper, we are illustrating the need to analyze the PCB design space to identify relevant configurations, we propose steps for data pre-processing to ensure consistency across diverse designs, and are laying the groundwork for a standardized PCB representation format — a key step toward unifying ML-driven workflows in electronic design. By streamlining how PCB data is represented and filtered, we hope to make machine learning more accessible, scalable, and impactful. 🚀💡

Find out more in our paper that Til Hillebrecht as presented at SPI 2025. Here: https://lnkd.in/eEZHMRZh

Our latest research, “Adaptive On-the-Fly Scan Method for Fast and Efficient Planar Near-Field Acquisition”, is now available with Early Access in IEEE Antennas and Wireless Propagation Letters! Thanks to all co-authors — Cheng Yang, Tomas Monopoli, Sebastian Götschel, Xinglong Wu, Flavia Grassi, and Christian Schuster — we’ve pushed the boundaries of near-field measurement once again. Using Gaussian Process Regression (GPR) and Bayesian optimization, we developed an adaptive method that significantly accelerates planar near-field data acquisition — paving the way for smarter, faster antenna testing.
🔍 This technique will play a key role in the Next Generation City Networking (NGCN) project, where we explore machine learning for 6G communication channels in complex urban environments.

👉 Check out the paper here: https://lnkd.in/eWU52hSF

On May 20th, we had the pleasure of welcoming Lars Meyer, TUHH alumnus and RF Development Engineer at IMST GmbH, for an insightful guest talk titled: “IMST – Radar, Empire, EM TWIN and more…” Lars shared his journey from studying Electrical Engineering at Hamburg University of Technology to working on innovative projects at IMST, including developing radar solutions for wind turbine monitoring, object tracking in industrial environments, and emergency detection in public spaces. It was a fantastic opportunity for our students and researchers to gain firsthand insights into real-world challenges and applications in RF engineering. Thank you, Lars, for your inspiring talk and for staying in contact!

Great time at APEMC 2025 in Taipeh! After the opening + keynotes we enjoyed lunch together talking EMC and how it is driven by hashtag#AI.

In the picture from left to right: * Dr. Chen-Hua Douglas Yu *, Distinguished Fellow and R&D Vice President, TSMC (Keynote Presenter); * Prof. Ding-Bing Lin *, National Taiwan University of Science and Technology (Technical Program Committee Chair) * Prof. Tzong-Lin Wu *, National Taiwan University (International Advisory Committee), * Prof. Christian Schuster *, Hamburg University of Technology (Keynote Presenter); * Prof. Madhavan Swaminathan *, Department Head, Department of Electrical Engineering, the William E. Leonhard Endowed Chair & Director for the Center for Heterogeneous Integration of Micro Electronic Systems, Penn State University (Keynote Presenter).
https://www.apemc2025.org/

On May 15, we had the pleasure of hosting two outstanding IEEE EMC Society Distinguished Lecturers at Hamburg University of Technology (TUHH).
🎤 Talk 1: How Close Can Far-Field Be? Getting the Best Out of Your Measurement Range
📍 Speaker: Dr. Benoit Derat, Senior Director at Rohde & Schwarz, Munich, Germany
🎤 Talk 2: Can You Identify an Electromagnetic Photo? – EMC Analysis Enhanced by Artificial Intelligence
📍 Speaker: Prof. wei xing chang, Zhejiang University, China
It was a fantastic opportunity for students and researchers to gain insights into cutting-edge EMC measurement techniques and the growing role of AI in electromagnetic analysis.
A big thank you to both speakers and everyone who joined us!
The photo shows from left to right: Dr. Benoit Derat; wei xing chang; Cheng Yang and Christian Schuster.

📅 When? August 19–21, 2025
🔗 More info & registration: https://conta.cc/442YqVS
⏳ Early bird discount available until July 18!

Excited to see the Global SIPI University return as part of IEEE EMC+SIPI 2025! From August 19 to 21, 2025, attendees can look forward to two full days of deep technical insight into Signal Integrity (SI) and Power Integrity (PI).
Featured instructors and speakers include:
Stephen Scearce (Cisco); John Golding (Siemens); Bhyrav Mutnury (AMD); Brandon T. Gore (Samtec, Columbia SC); Matteo Cocchini (IBM); Madhavan Swaminathan (Penn State University); Eric Bogatin ( University Colorado); Roni Khazaka (McGill University, Montreal); Paul Peterson (R&S); Chulsoon Hwang (Missouri S&T); Hanfeng Wang (Google); Jayaprakash Balachandran (d-Matrix); Benjamin Dannan (Signal Edge Solution); Stefano Grivet-Talocia (Politecnico di Torino); Zhiping Yang (CEO of PCB Automation Inc.) and the Co-Chairs: Christian Schuster (Hamburg University of Technology) and Francesco de Paulis (University of L’Aquila).

🚀 We’re thrilled to welcome Mr. Abidur Rahman as a new research associate at our Institut für Theoretische Elektrotechnik (TET), Hamburg University of Technology! Over the next two and a half years, he will be conducting research on the topic: „Modeling and Measuring 6G Communication Channels for Future Urban Mobile Networks Using Machine Learning.“ His work is part of the “Next Generation City Networking” (NGCN) project, which explores innovative solutions for future mobility using wave field synthesis to enable high-bandwidth, low-latency wireless communication. This project falls under the umbrella of the Hanseatic (formerly Hamburg) Wireless Innovation Competence Center (HAWICC – Hanseatic Wireless Innovation Competence Center) – one of four locations nationwide of the German Center for Future Mobility (DZM), funded by the Federal Ministry for Digital and Transport. Welcome aboard the TET team – we’re looking forward to working with you and shaping the future of wireless communication! 🌐

🎉 All Our Submissions Accepted for EMC Europe Paris 2025!
We’re proud to share that all of our contributions to EMC Europe Paris 2025 — the leading European conference on electromagnetic compatibility — have been officially accepted! 🙌
🛠️ Workshop:
✅ “Recent Developments in Near-Field Measurement and Its Applications in EMC”→ Five invited presentations organized by Cheng Yang (TUHH), and David Pommerenke (TU Graz)
📄 Conference Papers:
1.    “Electric Vehicle HV-DC EMC Filter Loss due to Variations in AC-Load Configuration”
– Lennart Bohl (TUHH), Guido A. Rasek (Valeo), Mohamed Abdallah (Politecnico di Milano), Cheng Yang (TUHH), Christian Schuster (TUHH)

2.    “Full-Body vs. Head-Only Modeling: Full Wave Computational SAR and Adaptation of Corresponding ANN Models”
– Hamideh Esmaeili (TUHH), Cheng Yang (TUHH) ,Christian Schuster (TUHH)

👏 Huge thanks to our collaborators and team members for their outstanding work!
We’re looking forward to excitings discussions, with the global EMC community in Paris 🇫🇷 this September!
🔗 More about the conference: https://lnkd.in/dKpNuGeE

🎓Congratulations on successfully graduating with a doctorate – with honors! 🏅

We would like to congratulate Morten Schierholz on passing the oral examination of his doctoral thesis entitled: Methods of Machine Learning for Analysis and Decoupling of Power Delivery Networks on Printed Circuit Boards with distinction. With a great deal of commitment, scientific depth and a strong contribution to power integrity (PI), Mr. Schierholz not only passed the examination, but was also awarded a grade of honors – a special recognition for an outstanding achievement. We are proud to be able to support such young scientists at the Hamburg University of Technology and look forward to everything that is yet to come professionally and scientifically! Pictured from left to right: Prof. Markus Stiemer, Morten Schierholz, Prof. Christian Schuster and Prof. Gerhard Bauch

TUHH Press Release:
European Doctoral Network „Enabling Artificial Intelligence for Electromagnetic Compatibility“ – DN PATTERN 💡
The Hamburg University of Technology (TUHH) is proud to be part of a newly established Horizon Europe Marie Skłodowska-Curie Doctoral Network addressing a highly relevant topic: the application of artificial intelligence (AI) to ensure electromagnetic compatibility (EMC) in medical devices.
Congratulations to Prof Christian Schuster (Institut für Theoretische Elektrotechnik) and Prof. Matthias Mnich (TUHH Institute for Algorithms and Complexity), who are leading the DN PATTERN project at TUHH. 👏 Coordinated by Eindhoven University of Technology, the MSCA Doctoral Network DN PATTERN brings together expertise from AI, EMC, medical technology, risk management, and sustainability management.
The network unites 9 universities from 7 countries and 11 industry partners to train 16 PhD students in AI-driven product development. TUHH will host 2 of these positions, focusing on machine learning and data-driven EMC prediction for the development of safe and sustainable medical devices.
👉 Read more about the project

Modeling for EMC: From Physics to AI – Keynote by Prof. Christian Schuster at APEMC 2025 (sponsored by the IEEE EMC Society)⚡

We are excited to announce that Prof. Christian Schuster will be a keynote speaker at APEMC 2025, taking place from May 19-23 in Taipei, Taiwan. His talk will address a fundamental question:

📌 How does AI-driven modeling transform the design, testing, and optimization of EMC, Signal Integrity, and Power Integrity?

In his keynote, Prof. Schuster will explore this topic in depth. At Hamburg University of Technology (TUHH), we have collaborated with partners to compare traditional physics-based modeling with AI-driven, data-based approaches – and to examine their potential for EMC engineering. A special highlight will be the outlook on the European Doctoral Network DN PATTERN, which focuses on integrating Artificial Intelligence into EMC research. We look forward to insightful discussions at APEMC 2025 and to shaping the future of electromagnetic compatibility together. See you in Taipei! 🚀

We are excited to host two insightful Distinguished Lectures on May 15, 2025, co-organized by the IEEE EMC Society EMC German Chapter. These DL talks will cover both near-field and far-field testing, featuring leading specialists in artificial intelligence(AI), antenna measurement, and electromagnetic compatibility (EMC).
Date: Thursday, May 15, 2025
Time: 15:00 – 17:00 (3:00 – 5:00 p.m. UTC+2, Berlin Time)
Venue: Wissenschaftliches Kommunikationszentrum (Wikom, Room 0053/54, Building I), Denickestraße 22, 21073 Hamburg, Germany

12.02.2025: Leading International Engineering Association Honors Prof. Alexander Koelpin and Prof. Christian Schuster as IEEE Fellows.  At the beginning of the year, Prof. Dr. Alexander Kölpin from the Institute of High-Frequency Technology and Prof. Dr. Christian Schuster from the Institute für Theoretische Elektrotechnik at Hamburg University of Technology (TUHH) were honored by the IEEE professional association for their outstanding scientific achievements. The two new Fellows celebrated their success on February 12, 2025, together with colleagues from the Faculty of Electrical Engineering, Computer Science, and Mathematics. We extend our heartfelt congratulations to both of them!

The photo shows Prof. Christian Schuster (left) and Prof. Alexander Kölpin (right) with the Dean of Studies Prof. Daniel Ruprecht (center).

28.01. – 31.01.2025: We are thrilled to share that the Institut für Theoretische Elektrotechnik (TET) at Hamburg University of Technology (TUHH) and our esteemed partners had a fantastic presence at this years DesignCon 2025! We had the honor of presenting two research papers, during the oral sessions, contributing valuable insights to the field of high-speed PCB design:

🔹Prediction of Dielectric Constant and Copper Roughness Parameters of High-Speed Automotive PCB Digital Interconnects Using a Data-Based Model – exploring machine learning modeling techniques for improved automotive interconnect design. By Jose Enrique Hernandez Bonilla (Bosch), Golzar Alavi (Bosch), Torsten Reuschel (University of New Brunswick), Cheng Yang (TUHH) and Christian Schuster (TUHH).
🔹 Impedance Profile Prediction and Classification for PCB-Based PDN Decoupling Using Autoencoders – leveraging machine learning for efficient power distribution network optimization. By Youcef Hassab (TUHH), Jan Heßling (TUHH), Morten Schierholz, Jayaprakash Balachandran (dMatrix), Ihsan Erdin (Celestica), and Christian Schuster (TUHH).

The photo shows Youcef Hassab (left) and Jan Hessling (right).

29.01.2025: At DesignCon 2025 in January this year, Mr. Yousef Hassab had the honor of accepting the DesignCon 2024 Early-Career BPA winning paper on behalf of all contributors. In January 2024, Mr. Youcef Hassab (TUHH), together with Mr. Morten Schierholz, Ihsan Erdin (Celestica Inc.), Jayaprakash Balachandran (d-Matrix), and Christian Schuster, received the DesignCon 2024 Early-Career Best Paper Award for the conference paper “Applying Techniques of Transfer & Active Learning to Practical PCB Noise Decoupling.” In the photo, Mr. Hassab can be seen accepting the award at the ceremony.