@article{nokey,

title = {Relational SI/PI-Database for a Data-Driven Approach to PCB Design Automation and Performance Prediction },

author = {Til Hillebrecht and Tommy Weber and Johannes Alfert and Christian Schuster},

year  = {2025},

date = {2025-09-05},

journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},

keywords = {},

pubstate = {forthcoming},

tppubtype = {article}

}

@article{2024-9,

title = {Machine Learning Based Data Validation for Signal Integrity and Power Integrity Using Supervised Time Series Classification},

author = {Youcef Hassab and Til Hillebrecht and Fabian Lurz and Christian Schuster},

doi = {https://doi.org/10.1109/TEMC.2024.3474917},

year  = {2024},

date = {2024-10-16},

urldate = {2024-10-16},

journal = {IEEE Transactions on Electromagnetic Compatibility, Early Access, pp. 1 - 9},

keywords = {},

pubstate = {published},

tppubtype = {article}

}

@article{2024-6,

title = {Generation and Application of a Very Large Dataset for Signal Integrity Via Array and Link Analysis},

author = {Til Hillebrecht and Morten Schierholz and Youcef Hassab and Johannes Alfert and Christian Schuster},

doi = {https://doi.org/10.1109/TEMC.2024.3450307},

year  = {2024},

date = {2024-09-18},

urldate = {2024-09-18},

journal = {IEEE Transactions on Electromagnetic Compatibility, Early Access, pp. 1 -10},

keywords = {},

pubstate = {published},

tppubtype = {article}

}

@article{2022-2,

title = {Multiconductor Transmission Lines for Orbital Angular Momentum (OAM) Communication Links},

author = {Michael Wulff and Til Hillebrecht and Lei Wang and Cheng Yang and Christian Schuster},

doi = {10.1109/TCPMT.2022.3140920},

year  = {2022},

date = {2022-01-06},

urldate = {2022-01-06},

journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 2, pp. 329-340},

keywords = {},

pubstate = {published},

tppubtype = {article}

}