Publications
2022
Shielding of Orbital Angular Momentum Waves by a Cavity With Apertures Journal Article
In: IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 3, pp. 692-701 , 2022.
Regularized and Compressed Large-Scale Rational Macromodeling: Theory and Application to Energy-Selective Shielding Enclosures Journal Article
In: IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 5, pp. 1365-1379, 2022.
Parametric S-Parameters for PCB based Power Delivery Network Design Using Machine Learning Proceedings Article
In: IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25, 2022.
Signal Integrity Assessment of External ESD Protection for Gbits/s Data Rates on Ceramic Test Fixture Proceedings Article
In: IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25, 2022. 2022.
Effect of the Orientation of the Array Elements of Uniform Circular Antenna Arrays on Orbital Angular Momentum (OAM) Modes Proceedings Article
In: German Microwave Conference (GeMiC), Ulm, Germany, May 16 -18, 2022, ISSN: 2167-8022 .
Evaluation of Interconnects up to 100 GHz Using Machine Learning PhD Thesis
2022, ISBN: 978-3-8440-8534-1.
Iteration Dependent Waveform Relaxation for Hybrid Field Nonlinear Circuit Problems Journal Article
In: IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 4, pp. 1124-1139, 2022.
Improving Accuracy After Stability Enforcement in the Loewner Matrix Framework Journal Article
In: IEEE Transaction on Microwave Theory and Techniques, vol. 70, no. 2, pp.1037-1047, 2022.
Multiconductor Transmission Lines for Orbital Angular Momentum (OAM) Communication Links Journal Article
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 2, pp. 329-340, 2022.
2021
Analysis and Optimization of Nonlinear Diode Grids for Shielding of Enclosures With Apertures," Journal Article
In: IEEE Transactions on Electromagnetic Compatibility, vol. 63, no. 6, pp. 1884-1895, 2021.
Distributed Nonlinear Shielding in Power Delivery Networks on Printed Circuit Boards Proceedings Article
In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), virtual event, Austin, TX, USA, October 17-20, 2021.
Evaluation of Support Vector Machines for PCB based Power Delivery Network Classification Proceedings Article
In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), virtual event, Austin, TX, USA, October 17-20, 2021.
Introducing Functional Via Structures to Low Temperature Cofired Ceramics: How to Optimize Reliably and Efficiently Journal Article
In: IEEE Electromagnetic Compatibility Magazine, vol. 10, no. 4, pp. 35-45, 2021.
ANN Hyperparameter Optimization by Genetic Algorithms for Via Interconnect Classification Proceedings Article
In: IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12, 2021.
Efficient and Flexible Huygens’ Source Replacement of mm-scale Human Brain Implants Proceedings Article
In: Joint IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (EMCS+SIPI) and Symposium on EMC Europe (EMC Europe), virtual event, Glasgow, Scotland, July 26 - August 20, 2021.
Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics Proceedings Article
In: IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12, 2021.
Numerical Analysis of Two MIMO Channels Carrying Orbital Angular Momentum (OAM) Proceedings Article
In: European Conference on Antennas and Propagation (EuCAP), virtual event, Düsseldorf, Germany, March 22-26, 2021.
Vertical Integration of Passive Microwave Components Using Functional Via Structures in LTCC Multilayer Substrates Journal Article
In: IEEE Transactions of Components, Packaging and Manufacturing Technology, vol. 11, no. 4, pp. 635-646, 2021.
Macromodeling of Mutual Inductance for Displaced Coils Based on Laplace’s Equation Journal Article
In: IEEE Transactions on Instrumantation and Measurement, vol. 70, 2021.
A Multistage Adaptive Sampling Scheme for Passivity Characterization of Large-Scale Macromodels Journal Article
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 3, pp. 471-484, 2021.
SI/PI-Database of PCB-Based Interconnects for Machine Learning Applications Journal Article
In: IEEE Access, vol. 9, pp. 34423-34432, 2021.
Vertically Integrated Microwave-Filters Using Functional Via Structures in LTCC Proceedings Article
In: European Microwave Conference (EuMC), virtual event, Utrecht, Netherlands, Jan. 12-14, 2021.
2020
ANN Performance for the Prediction of High-Speed Digital Interconnects over Multiple PCBs Proceedings Article
In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) San Jose, CA, USA, 2020.
Wireless Communication of Radio Waves Carrying Orbital Angular Momentum (OAM) Above an Infinite Ground Plane Journal Article
In: IEEE Transactions on Electromagnetic Compatibility, vol. 62, no. 5, pp. 2257-2264, 2020.
Bayesian Optimization for Signal Transmission Including Crosstalk in a Via Array Proceedings Article
In: International Symposium on Electromagnetic Compatibility, Rome, Italy, Sept. 23-25, 2020.