@inproceedings{2021-8,

title = {Distributed Nonlinear Shielding in Power Delivery Networks on Printed Circuit Boards},

author = {Torben Wendt and Cheng Yang and Stefano and Stefano Grivet-Talocia and Christian Schuster},

doi = {10.1109/EPEPS51341.2021.9609177},

year  = {2021},

date = {2021-11-24},

urldate = {2021-11-24},

organization = {IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), virtual event, Austin, TX, USA, October 17-20,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2021-9,

title = {ANN Hyperparameter Optimization by Genetic Algorithms for Via Interconnect Classification},

author = {Allan Sanchesz-Masis and Allan Carmona-Cruz and Christian Morten Schierholz and Xiaomin Duan and Troy J. Beukema and Cheng Yang and Renato Rimolo-Donadio and Christian Schuster},

doi = {10.1109/SPI52361.2021.9505202},

year  = {2021},

date = {2021-08-06},

urldate = {2021-08-06},

organization = {IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2021-6,

title = {Efficient and Flexible Huygens’ Source Replacement of mm-scale Human Brain Implants},

author = {Cheng Yang and Christian Morten Schierholz and Eileen Trunczik and Leon Maximilian Helmich and Heinz-Dietrich Brüns and Christian Schuster},

doi = {10.1109/EMC/SI/PI/EMCEurope52599.2021.9559298},

year  = {2021},

date = {2021-07-26},

urldate = {2021-07-26},

journal = {2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium},

organization = {Joint IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (EMCS+SIPI) and Symposium on EMC Europe (EMC Europe), virtual event, Glasgow, Scotland, July 26 - August 20,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2021-12b,

title = {Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics},

author = {Ömer Faruk Yildiz and Nico Pathè and Marc Bochard and Cheng Yang and Christian Schuster},

doi = {10.1109/SPI52361.2021.9505214},

year  = {2021},

date = {2021-05-10},

urldate = {2021-05-10},

organization = {IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2021-10,

title = {Numerical Analysis of Two MIMO Channels Carrying Orbital Angular Momentum (OAM)},

author = {Lei Wang and Michael Wulff and Cheng Yang and Christian Schuster},

doi = {10.23919/EuCAP51087.2021.9411418},

year  = {2021},

date = {2021-04-27},

urldate = {2021-04-27},

organization = {European Conference on Antennas and Propagation (EuCAP), virtual event, Düsseldorf, Germany, March 22-26,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2021-1,

title = {Vertically Integrated Microwave-Filters Using Functional Via Structures in LTCC},

author = {Ömer Faruk Yildiz and Ole Thomsen and Cheng Yang and Christian Schuster},

doi = {10.23919/EuMC48046.2021.9338027},

year  = {2021},

date = {2021-02-02},

urldate = {2021-02-02},

organization = {European Microwave Conference (EuMC), virtual event, Utrecht, Netherlands, Jan. 12-14,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2020-7,

title = {ANN Performance for the Prediction of High-Speed Digital Interconnects over Multiple PCBs},

author = {Katharina Scharff and Christian Morten Schierholz and Cheng Yang and Christian Schuster},

doi = {10.1109/EPEPS48591.2020.9231490},

year  = {2020},

date = {2020-10-20},

urldate = {2020-10-20},

address = {San Jose, CA, USA},

organization = {IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2020-8,

title = {Bayesian Optimization for Signal Transmission Including Crosstalk in a Via Array},

author = {Katharina Scharff and Hakki M. Torun and Cheng Yang and Madhavan Swaminathan and Christian Schuster},

doi = {10.1109/EMCEUROPE48519.2020.9245762},

year  = {2020},

date = {2020-09-23},

urldate = {2020-09-23},

organization = {International Symposium on Electromagnetic Compatibility, Rome, Italy, Sept. 23-25,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2020-4,

title = {Numerical Investigation of OAM Based Indoor Communication in a Corridor with Electrical Conducting Walls},

author = {Lei Wang and Michael Wulff and Cheng Yang and Woocheon Park and Christian Schuster},

doi = {10.1109/UCET51115.2020.9205453},

year  = {2020},

date = {2020-08-20},

urldate = {2020-08-20},

address = {August, 20},

organization = {International Conference on UK–China Emerging Technologies (UCET)},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2020-3,

title = {Comparison of Collaborative versus Extended Artificial Neural Networks for PDN Design},

author = {Christian Morten Schierholz and Cheng Yang and Kallol Roy and Madhavan Swaminathan and Christian Schuster},

doi = {10.1109/SPI48784.2020.9218157},

year  = {2020},

date = {2020-05-18},

urldate = {2020-05-18},

address = {Cologne, Germany, May 17-20},

organization = {IEEE Workshop on Signal and Power Intergrity (SPI)},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2020-1,

title = {Using Orbital Angular Momentum (OAM) Modes on Multi-Conductor Cables for Crosstalk Mitigation},

author = {Michael Wulff and Lei Wang and Cheng Yang and Heinz-Dietrich Brüns and Christian Schuster},

doi = {10.1109/SPI48784.2020.9218177},

year  = {2020},

date = {2020-05-18},

urldate = {2020-05-18},

address = {Cologne, Germany, May 17-20},

organization = {IEEE Workshop on Signal and Power Integrity,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2019-17,

title = {Numerical complexity study of solving hybrid multiport field-circuit problems for diode grids},

author = {Torben Wendt and Cheng Yang and Christian Schuster and Stefano Grivet-Talocia},

doi = {10.1109/ICEAA.2019.8879021},

year  = {2019},

date = {2019-09-09},

urldate = {2019-09-09},

organization = {International Conference on Electromagnetics in Advanced Applications (ICEAA), Granada, Spain, September 9-13,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2016-16,

title = {Design Aspects for HIRF Protection of a Rectangular Metallic Cavity Using Energy Selective Diode Grids},

author = {Cheng Yang and Peiguo Liu and Heinz-Dietrich Brüns and Christian Schuster},

doi = {10.1109/APEMC.2016.7522736},

year  = {2016},

date = {2016-05-18},

address = {Shenzhen, China, May 18-21},

organization = {IEEE Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC),},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2015-7,

title = {Validation of a Flexible Causality Treatment for Transient Analysis of Nonlinearly Loaded Structures},

author = {Cheng Yang and Heinz-Dietrich Brüns and Peiguo Liu and Christian Schuster},

doi = {10.1109/ISEMC.2015.7256210},

year  = {2015},

date = {2015-08-16},

urldate = {2015-08-16},

address = {Dresden, Germany, August 16-22},

organization = {2015 IEEE International Symposium on Electromagnetic Compatibility (EMC),},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}