2016/17

2017

Heinz-Dietrich Brüns, Alexander Vogt, Christian Findeklee, Arne Schörder, Mathias Magdowski, Martin Robinson,
Fridolin Heidler, Christian Schuster
Modeling Challenging EMC Problems
IEEE Electromagnetic Compatibility Magazine, Vol. 6, Quater 3, 2017

Ernesto Carrera-Retana, Renato Rimolo-Donadio, Christian Schuster
Evaluation of Concatenation Techniques for State-Space Interconnect Macromodels
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, USA, October 15-18, 2017

Torsten Reuschel, Jan Birger Preibisch, Katharina Scharff, Renato Rimolo-Donadio, Xiaomin Duan, Young H. Kwark,
Christian Schuster
Efficient Prediction of Equalization Effort and Channel Performance for PCB-Based Data Links
IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 7, No. 11, 2017

Sangwook Park, Miroslav Kotzev, Heinz-D. Brüns, Dong Gun Kam, Christian Schuster
Lessons from Applying IEEE Standard 1597 for Validation of Computational Electromagnetics Computer Modeling and Simulations
IEEE Electromagnetic Compatibility Magazine, Vol. 6, Quarter 2, 2017

Fabian Happ, Heinz-Dietrich Brüns, Frank Gronwald
Efficient Computation of Field Coupling through Aperture Arrays into Casings
International Conference on Electromagnetics in Advanced Applications (ICEAA), Verona, Italy, September 11-15, 2017

Ömer Faruk Yildiz, Jan Birger Preibisch, Jan Niehof, Christian Schuster
Sensitivity Analysis and Empirical Optimization of Cross-Domain Coupling on RFICs using Polynomial Chaos Expansion
IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (EMC+SIPI), Washington, D.C., USA, August 7-11, 2017

Jan Birger Preibisch, Xiaomin Duan, Christian Schuster
Corrections to “An Efficient Analysis of Power/Ground Planes With Inhomogeneous Substrates Using the Contour Integral Method”
IEEE Transactions on Electromagnetic Compatibility, Vol. 59, No. 3, 2017

Eduard Frick, Jan Birger Preibisch, Christian Seifert, Marko Lindner, Christian Schuster
Variability Analysis of Via Crosstalk Using Polynomial Chaos Expansion
IEEE International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization for RF, Microwave and Terahertz Applications (NEMO), Sevilla, Spain, May 17-19, 2017

Torsten Reuschel, Jan Birger Preibisch, Christian Schuster
Efficient Design of Continuous Time Linear Equalization for Loss Dominated Digital Links
IEEE Workshop on Signal and Power Integrity (SPI), Lake Maggiore (Baveno), Italy, May 7-10, 2017

Katharina Scharff, Torsten Reuschel, Xiaomin Duan, Heinz-Dietrich Brüns, Christian Schuster
Exploration of Differential Via Stub Effect Mitigation by Using PAM4 and PAM8 Line Coding
IEEE Workshop on Signal and Power Integrity (SPI), Lake Maggiore (Baveno), Italy, May 7-10, 2017

David Dahl, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster
Effect of 3D Stack-Up Integration on Through Silicon Via Characteristics
IEEE Workshop on Signal and Power Integrity (SPI), Lake Maggiore (Baveno), Italy, May 7-10, 2017

Fabian Happ, Arne Schröder, Gazmend Mavraj, Heinz-Dierich Brüns, Frank Gronwald
Numerical Shielding Analysis of Anisotropic Multilayer Materials by the Method of Moments
IEEE Transactions on Electromagnetic Compatibility, Vol. 59, No. 1, February, 2017

Jan Philip Speichert, Thorsten Kiehl, Ralf God, Heinz-Dietrich Brüns, Christian Schuster
Simulation-Based Validation of Near Field Communication Effects on Aircraft Wiring
International Workshop on Aircraft System Technologies (AST), Hamburg, Germany, February 21–22, 2017

Yu Zhao, Rainer Grünheid, Gerhard Bauch, Torsten Reuschel, Christian Schuster
Redundant and Non-Redundant Spectrum Shaping Schemes for Reflection-Limited Chip-to-Chip Communication
International ITG Conference on Systems, Communication and Coding (SCC), Hamburg, Germany, February 6-9, 2017

Jan Birger Preibisch, Jayaprakash Balachandran, Torsten Reuschel, Katharina Scharff, Bidyut Sen,
Christian Schuster
Exploring Efficient Variability-Aware Analysis Method for High-Speed Digital Link Design Using PCE
UBM DesignCon Conference, Santa Clara, CA, USA, January 31 – February 2, 2017

2016

Qi Wu, Heinz-Dietrich Brüns, Christian Schuster
Characteristic Mode Analysis of Radiating Structures in Digital Systems
IEEE Electromagnetic Compatibility Magazine, vol.5, Quater 4, 2016

David Dahl, Torsten Reuschel, Jan Birger Preibisch, Xiaomin Duan, Ivan Ndip, Klaus-Dieter Lang,
Christian Schuster
Efficient Total Crosstalk Analysis of Large Via Arrays in Silicon Interposers
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 12, December 2016

Luis Ernesto Carrera-Retana, Renato Rimolo-Donadio, Christian Schuster
Evaluation of Vector Fitting for Compact Interconnect Model Representation
IEEE Convention of Central America and Panama Region (CONCAPAN), San Jose, Costa Rica, November 9-11, 2016

Fabian Happ, Heinz-Dietrich Brüns, Gazmend Mavraj, Frank Gronwald
Numerical Computation of Lightning Transfer Functions for Layered, Anisotropically Conducting Shielding Structures by the Method of Moments
Advances in Radio Science, Special Issue: Kleinheubacher Berichte 2016

Miroslav Kotzev, Matthias Kreitlow, Frank Gronwald
Design and Analysis of Ultra-Wideband Antennas for Transient Field Excitations
Advances in Radio Science, Special Issue: Kleinheubacher Berichte 2016

Jesper H.G.J. Lansink Rotgerink, Fabian Happ, Jan-Joris van Es
Crosstalk between wire pairs above a composite ground plane
EMC Europe, Wroclaw, Poland, September 5 – 9, 2016

Jan Birger Preibisch, Christian Schuster
Extension of the Contour Integral Method for the Modeling of TE Scattering in Two-Dimensional Photonic Structures Using the Duality Principle
10th International Congress on Advanced Electromagnetic Materials in Microwaves and Optics (Metamaterials’), Crete, Greece, September 19-22, 2016

Miroslav Kotzev, Matthias Kreitlow, Frank Gronwald
Transient Excitation of Nonlinearly Loaded Resonators and Observation of System Responses in Time Domain
EMC Europe, Wroclaw, Poland, September 5 – 9, 2016

Fabian Happ, Gazmend Mavraj, Heinz-Dietrich Brüns, Frank Gronwald
On the Choice of Huygens’ Surfaces in the Vicinity of Electrically Small Apertures
EMC Europe, Wroclaw, Poland, September 5 – 9, 2016

Cheng Yang, Heinz-Dietrich Brüns, Peiguo Liu, Christian Schuster
Impulse Response Optimization of Band-Limited Frequency Data for Hybrid Field-Circuit Simulation of Large-Scale Energy-Selective Diode Grids
IEEE Transaction on Electromagnetic Compatibility, Vol. 58, No. 4, August 2016

Alexander Vogt, Torsten Reuschel, Heinz-Dietrich Brüns, Sabine Le Borne, Christian Schuster
On the Treatment of Arbitrary Boundary Conditions Using a Fast Direct H-Matrix Solver in MoM
IEEE Transactions on Antennas and Propagation, Vol. 64, no.8, August 2016

Torsten Reuschel, Miroslav Kotzev, David Dahl, Christian Schuster
Modeling of Differential Striplines in Segmented Simulation of Printed Circuit Board Links
IEEE Signal and Power Integrity Conference (SIPI 2016), Ottawa, ON, Canada, July 25-29, 2016

Jan Birger Preibisch, Piero Triverio, Christian Schuster
Design Space Exploration for Printed Circuit Board Vias Using Polynomial Chaos Expansion
IEEE Signal and Power Integrity Conference (SIPI 2016), Ottawa, ON, Canada, July 25-29, 2016

Xiaomin Duan, Mathias Boettcher, David Dahl, Christian Schuster, Christian Tschoban, Ivan Ndip, Klaus-Dieter Lang
High Frequency Characterization of Silicon Substrate and through Silicon Vias
Electronic Components and Technology Conference (ECTC), Las Vegas, NV, US, May 31 – June 3, 2016

Qi Wu, Heinz-Dietrich Brüns, Christian Schuster
Evaluation of isolation between blade antennas in pre-design phase using a synthesized model
IEEE Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Shenzhen, China, May 18-21, 2016.

Cheng Yang, Peiguo Liu, Heinz-Dietrich Brüns, Christian Schuster
Design Aspects for HIRF Protection of a Rectangular Metallic Cavity Using Energy Selective Diode Grids
IEEE Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Shenzhen, China, May 18-21, 2016.

Jan Birger Preibisch, Torsten Reuschel, Katharina Scharff, Christian Schuster
Impact of Continuous Time Linear Equalizer Variability on Eye Opening of High-Speed Links
IEEE Workshop on Signal and Power Integrity (SPI), Turin, Italy, May 8-11, 2016

David Dahl, Torsten Reuschel, Xiaomin Duan, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster
On the Upper Bound of Total Uncorrelated Crosstalk in Large Through Silicon Via Arrays
IEEE Workshop on Signal and Power Integrity (SPI), Turin, Italy, May 8-11, 2016

Miroslav Kotzev, Matthias Kreitlow, Frank Gronwald
Transiente Analyse von nichtlinear beladenen metallischen Gehäusen in Zeit- und Frequenzbereich
Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit (EMV Düsseldorf) , Düsseldorf, Germany, February 23-25, 2016

Alexander Vogt, Heinz-Dietrich Brüns, Christian Schuster
Auswirkung absorbierender Materialien auf die Verkopplung von Komponenten innerhalb eines PC-Gehäuses
Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit (EMV Düsseldorf) , Düsseldorf, Germany, February 23-25, 2016

Torsten Reuschel, Sebastian Müller, Christian Schuster
Segmented Physics-Based Modeling of Multilayer Printed Circuit Boards Using Stripline Ports
IEEE Transactions on Electromagnetic Compatibility, vol. 58, no. 1, Februar 2016

Young H. Kwark, Torsten Reuschel, Renato Rimolo-Donadio, Dierk Kaller, Thomas-M. Winkel, Hubert Harrer,
Christian Schuster
Systematic analysis of electrical link bottlenecks and strategies for their equalization
DesignCon, Santa Clara, CA, USA, 19. -21. Januar 2016.

Xiaomin Duan, David Dahl, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster
A Rigorous Approach for the Modeling of Through-Silicon-Via Pairs Using Multipole Expansions
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 1, Januar 2016