2014/15

2015

David Dahl, Xiaomin Duan, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster
Efficient Computation of Localized Fields for Through Silicon Via Modeling Up to 500 GHz
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 5, no. 12, Dezember 2015

Alexander Vogt, Heinz-D. Brüns, Qi Wu, Frank Gronwald, Christian Schuster
A Measurement Setup for Quantification of Electromagnetic Interference in Metallic Casings
IEEE Transactions on Electromagnetic Compatibility, vol.57, no.6, Dezember 2015

Sebastian Müller, Torsten Reuschel, Renato Rimolo-Donadio, Young H. Kwark, Heinz-D. Brüns, Christian Schuster
Energy-Aware Signal Integrity Analysis for High-Speed PCB Links
IEEE Transactions on Electromagnetic Compatibility, vol.57, no.5, Oktober 2015

Xiaomin Duan, Mathias Böttcher, Stephan Dobritz, David Dahl, Christian Schuster, Ivan Ndip, Klaus-Dieter Lang
Comparison of Passivation Materials for High frequency 3D Packaging Application up to 110 GHz
European Microelectronics and Packaging Conference & Exhibition (EMPC), Friedrichshafen, Germany,
September 14-16, 2015

Qi Wu, Alexander Vogt, Jan B. Preibisch, Andreas Hardock, Heinz.-D. Brüns, Christian Schuster
Modeling of Mutual Coupling between Coaxial Probes in Flat Metallic Casings Using the Contour Integral Method
ICEAA-IEEE APWC 2015, International Conference on Electromagnetics in Advanced Applications, Turin, Italy,
September 07-11, 2015

Qi Wu, Alexander Vogt, Heinz-D. Brüns, Frank Gronwald, Christian Schuster
Numerical and Experimental Evaluation of Electromagnetic Coupling between Radiating Antenna Structures inside a Computer Casing
Joint IEEE International Symposium on Electromagnetic Compatibility and EMC Europe, Dresden, Germany, August 16-22, 2015

Cheng Yang, Heinz-D. Brüns, Peiguo Liu, Christian Schuster
Validation of a Flexible Causality Treatment for Transient Analysis of Nonlinearly Loaded Structures
Joint IEEE International Symposium on Electromagnetic Compatibility and EMC Europe, Dresden, Germany,
August 16-22, 2015

Fabian Happ, Frank Gronwald, Heinz-D. Brüns
An Extension of Schelkunoff’s Shielding Theory to Anisotropic Conducting Multilayer Materials
Joint IEEE International Symposium on Electromagnetic Compatibility and EMC Europe, Dresden, Germany,
August 16-22, 2015

Jan Birger Preibisch, Piero Triverio, Christian Schuster
Efficient Stochastic Transmission Line Modeling Using Polynomial Chaos Expansion with Multiple Variables
IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), Ottawa, Canada, August 11-14, 2015

Gazmend Mavraj, Frank Gronwald,
On the Limits of Numerical Modelling of Electromagnetic Field Coupling through Small Apertures
PIERS Proceedings, Prag, Tschechien, July 6-9, 2015

Jan Birger Preibisch, Andreas Hardock, Christian Schuster
Physics-Based Via and Waveguide Models for Efficient SIW Simulations in Multilayer Substrates
IEEE Transactions on Microwave Theory and Techniques,vol. 63, no. 6, June 2015

Xiaomin Duan, David Dahl, Christian Schuster, Ivan Ndip, Klaus-Dieter Lang
Efficient Analysis of Wave Propagation for Through-Silicon-Via Pairs using Multipole Expansion Method
IEEE Workshop on Signal and Power Integrity (SPI), Berlin, Germany, May 10-13, 2015

Jan Birger Preibisch, Piero Triverio, Christian Schuster
Sensitivity Analysis of Via Impedance using Polynomial Chaos Expansion
IEEE Workshop on Signal and Power Integrity (SPI), Berlin, Germany, May 10-13, 2015

Andreas Hardock, David Dahl, Heinz-Dietrich Brüns, Christian Schuster
Efficient Calculation of External Fringing Capacitances for Physics-Based PCB Modeling
IEEE Workshop on Signal and Power Integrity (SPI), Berlin, Germany, May 10-13, 2015

Qi Wu, W. Su
Rigorous Eigenmode Analysis of Conducting Sphere
9th European Conference on Antennas and Propagation, EuCAP 2015, Lisabon, Portugal, 12-17 April, 2015

Andreas Hardock, Christian Schuster
Using Coupled Vias for Band-Pass Filters in Multilayered Printed-Circuit Boards
German Microwave Conference (GeMic), Nürnberg, Germany, March 16-18, 2015

Andreas Hardock, Heinz-D. Brüns, Christian Schuster
Chebyshev Filter Design Using Vias as Quasi-Transmission Lines in Printed Circuit Boards
IEEE Transactions on Microwave Theory and Techniques, vol. 63, no. 3, March 2015

Yao-Jiang Zhang, Liehui Ren, Dazhao Liu, Soumya De, Xiaoxiong Gu, Young H. Kwark, Christian Schuster, Jun Fan
An Efficient Hybrid Finite-Element Analysis of Multiple Vias Sharing the Same Anti-Pad in an Arbitrarily Shaped Parallel-Plate Pair
IEEE Transactions on Microwave Theory and Techniques, vol. 63, no. 3, March 2015

Qi Wu, Xiaojing Ding, Aixin Chen
A Broadband Dipole Antenna for Multi-Service Indoor Distributed Antenna System (MS-IDAS)
IEEE Antennas and Wireless Propagation Letters, vol. 14, 2015

2014

Qi Wu, Siyuan Guo, Donglin Su
On the Eigenmodes of Small Conducting Objects
IEEE Antennas and Wireless Propagation Letters, vol. 13, 2014

Frank Gronwald
Frequency versus Time Domain Immunity Testing of Smart Grid Components
Advances in Radio Science, vol. 12, 2014

David Dahl, Sebastian Müller, Christian Schuster
Effect of Layered Media on the Parallel Plate Impedance of Printed Circuit Boards
IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium, India, Bangalore, December 14-16, 2014

Miroslav Kotzev, Young Kwark, Sebastian Müller, Andreas Hardock, Renato Rimolo-Donadio, Christian Baks, Christian Schuster
High Frequency Measurement Techniques for Vias in Printed Circuit Boards
IEEE Electromagnetic Compatibility Magazine, vol. 3, no. 4, 2014

Jan Luiken ter Haseborg, Christian Schuster, Manfred Kasper
Fit für die Prüfung – Elektrotechnik
Carl Hanser Verlag Leipzig, Germany, 2014

Qi Wu, Xiaojing Ding, Donglin Su
Theoretic and Experimental Analysis of a Reflector-backed Dipole Antenna for 1-3 GHz EMC Test
IEEE International Symposium on Electromagnetic Compatibility, EMC Europe 2014, Göteborg, Schweden, September 1-4, 2014

Fabian Happ, Heinz-D. Brüns, Frank Gronwald
Benchmark Calculations of Magnetic Shielding at Low Frequencies
IEEE International Symposium on Electromagnetic Compatibility, EMC Europe 2014, Göteborg, Schweden, September 1-4, 2014

Frank Gronwald
On advanced transmitter and receiver models for the EMC analysis of modern communication systems
General Assembly of the International Union of Radio Science (URSI), Beijing, China, August 16-23, 2014

Jan B. Preibisch, Xiaomin Duan, Christian Schuster
An Efficient Analysis of Power/Ground Planes With Inhomogeneous Substrates Using the Contour Integral Method
IEEE Transactions on Electromagnetic Compatibility, vol. 56, no. 4, August 2014

Andreas Hardock, Young H. Kwark, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster
Using Via Stubs in Periodic Structures for Microwave Filter Design
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, no. 7, July 2014

Andreas Hardock, Renato Rimolo-Donadio, Sebastian Müller, Young H. Kwark, and Christian Schuster
Signal integrity: Efficient, physics-based via modeling: Return path, impedance, and stub effect control
IEEE Electromagnetic Compatibility Magazine, vol. 3, no. 1

David Dahl, Anne Beyreuther, Xiaomin Duan, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster
Analysis of Wave Propagation along Coaxial Through Silicon Vias Using a Matrix Method
IEEE Workshop on Signal and Power Integrity (SPI), Ghent, Belgium, May 11-14, 2014

Torsten Reuschel, Sebastian Müller, Heinz-D. Brüns, Christian Schuster
Investigation of Long Range Differential Crosstalk on Printed Circuit Boards
IEEE Workshop on Signal and Power Integrity (SPI), Ghent, Belgium, May 11-14, 2014

Arne Schröder, Heinz-D. Brüns, Christian Schuster
Fast Evaluation of Electromagnatic Fields using a Parallelized Adaptive Cross Approximation
IEEE Transactions on Antennas and Propagation, vol. 62, no. 5, May 2014.

Fabian Happ, Heinz-D. Brüns, Frank Gronwald
Numerische Simulation der Schirmwirkung von mehrlagigen, anisotrop leitfähigen Materialien
Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit (EMV Düsseldorf) , Düsseldorf, Germany, March 11-13, 2014

Frank Gronwald, Fabian Happ
Methoden der Netzwerkmodellierung von Transferfunktionen indirekter Blitzeffekte auf Grundlage numerischer Simulation in Zeit- und Frequenzbereich
Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit (EMV Düsseldorf) , Düsseldorf, Germany, March 11-13, 2014

Alexander Vogt, Heinz-D. Brüns, Christian Schuster
Einfluss von absorbierenden Materialien auf die elektromagnetische Strahlung von Leiterplatten
Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit (EMV Düsseldorf) , Düsseldorf, Germany, March 11-13, 2014

Sebastian Müller, Heinz-D. Brüns, Christian Schuster
Einfluss der Routinglage in Via-Arrays auf die Signalqualität bei hohen Datenraten
Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit (EMV Düsseldorf) , Düsseldorf, Germany, March 11-13, 2014

Mathias Magdowski, Arne Schröder, Heinz-D. Brüns, Ralf Vick
Effiziente Simulation der Einkopplung statistischer Felder in Leitungsstrukturen mit der Momentenmethode
Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit (EMV Düsseldorf) , Düsseldorf, Germany, March 11-13, 2014

Arne Schröder, Guido A. Rasek, Heinz-D. Brüns, Zdenek Reznicek, Jaromir Kucera, Steffen E. Loos, Christian Schuster
Analysis of High Intensity Radiated Field Coupling into Aircraft using the Method of Moments
IEEE Transactions on Electromagnetic Compatibility, vol. 56, no. 1, Februar 2014