@inproceedings{2022-3,

title = {Parametric S-Parameters for PCB based Power Delivery Network Design Using Machine Learning},

author = {Christian Morten Schierholz and Ihsan Erdin and Jayaprakash Balachandran and Cheng Yang and Christian Schuster },

doi = {https://doi.org/10.1109/SPI54345.2022.9874946},

year  = {2022},

date = {2022-05-22},

urldate = {2022-05-22},

organization = {IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2022-5,

title = {Signal Integrity Assessment of External ESD Protection for Gbits/s Data Rates on Ceramic Test Fixture},

author = {Torben Wendt and Cheng Yang and Christian Schuster},

doi = {https://doi.org/10.1109/SPI54345.2022.9874937},

year  = {2022},

date = {2022-05-22},

urldate = {2022-05-22},

organization = {IEEE Workshop on Signal and Power Integrity (SPI), Siegen, Germany, May 22 -25, 2022.},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2022-14,

title = {Effect of the Orientation of the Array Elements of Uniform Circular Antenna Arrays on Orbital Angular Momentum (OAM) Modes },

author = {Michael Wulff and Lei Wang and Cheng Yang and Christian Schuster},

issn = {2167-8022 },

year  = {2022},

date = {2022-05-16},

urldate = {2022-05-16},

organization = {German Microwave Conference (GeMiC), Ulm, Germany, May 16 -18,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2021-8,

title = {Distributed Nonlinear Shielding in Power Delivery Networks on Printed Circuit Boards},

author = {Torben Wendt and Cheng Yang and and Marco de Stefano and Stefano Grivet-Talocia and Christian Schuster },

doi = {10.1109/EPEPS51341.2021.9609177},

year  = {2021},

date = {2021-11-24},

urldate = {2021-11-24},

organization = {IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), virtual event, Austin, TX, USA, October 17-20, },

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2021-7,

title = {Evaluation of Support Vector Machines for PCB based Power Delivery Network Classification},

author = {Christian Morten Schierholz and Youcef Hassab and Christian Schuster},

doi = {10.1109/EPEPS51341.2021.9609190},

year  = {2021},

date = {2021-11-24},

urldate = {2021-11-24},

organization = {IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), virtual event, Austin, TX, USA, October 17-20, },

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2021-9,

title = {ANN Hyperparameter Optimization by Genetic Algorithms for Via Interconnect Classification},

author = {Allan Sanchesz-Masis and Allan Carmona-Cruz and Christian Morten Schierholz and Xiaomin Duan and Troy J. Beukema and Cheng Yang and Renato Rimolo-Donadio and Christian Schuster},

doi = {10.1109/SPI52361.2021.9505202},

year  = {2021},

date = {2021-08-06},

urldate = {2021-08-06},

organization = {IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12, },

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2021-6,

title = {Efficient and Flexible Huygens’ Source Replacement of mm-scale Human Brain Implants},

author = {Cheng Yang and Christian Morten Schierholz and Eileen Trunczik and Leon Maximilian Helmich and Heinz-Dietrich Brüns and Christian Schuster},

doi = {10.1109/EMC/SI/PI/EMCEurope52599.2021.9559298},

year  = {2021},

date = {2021-07-26},

urldate = {2021-07-26},

journal = {2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium},

organization = {Joint IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (EMCS+SIPI) and Symposium on EMC Europe (EMC Europe), virtual event, Glasgow, Scotland, July 26 - August 20,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2021-12b,

title = {Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics},

author = {Ömer Faruk Yildiz and Nico Pathè and Marc Bochard and Cheng Yang and Christian Schuster},

doi = {10.1109/SPI52361.2021.9505214},

year  = {2021},

date = {2021-05-10},

urldate = {2021-05-10},

organization = {IEEE Workshop on Signal and Power Integrity (SPI), virtual event, Siegen, Germany, May 10-12, },

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2021-10,

title = {Numerical Analysis of Two MIMO Channels Carrying Orbital Angular Momentum (OAM)},

author = {Lei Wang and Michael Wulff and Cheng Yang and Christian Schuster},

doi = {10.23919/EuCAP51087.2021.9411418},

year  = {2021},

date = {2021-04-27},

urldate = {2021-04-27},

organization = {European Conference on Antennas and Propagation (EuCAP), virtual event, Düsseldorf, Germany, March 22-26,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2021-1,

title = {Vertically Integrated Microwave-Filters Using Functional Via Structures in LTCC},

author = {Ömer Faruk Yildiz and Ole Thomsen and Cheng Yang and Christian Schuster},

doi = {10.23919/EuMC48046.2021.9338027},

year  = {2021},

date = {2021-02-02},

urldate = {2021-02-02},

organization = {European Microwave Conference (EuMC), virtual event,  Utrecht, Netherlands, Jan. 12-14,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2020-7,

title = {ANN Performance for the Prediction of High-Speed Digital Interconnects over Multiple PCBs},

author = {Katharina Scharff and Christian Morten Schierholz and Cheng Yang and Christian Schuster},

doi = {10.1109/EPEPS48591.2020.9231490},

year  = {2020},

date = {2020-10-20},

urldate = {2020-10-20},

address = { San Jose, CA, USA},

organization = {IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{2020-8,

title = {Bayesian Optimization for Signal Transmission Including Crosstalk in a Via Array},

author = {Katharina Scharff and Hakki M. Torun and Cheng Yang and Madhavan Swaminathan and Christian Schuster },

doi = { 10.1109/EMCEUROPE48519.2020.9245762},

year  = {2020},

date = {2020-09-23},

urldate = {2020-09-23},

organization = {International Symposium on Electromagnetic Compatibility, Rome, Italy, Sept. 23-25,},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}