Publikationen
2010
Multiport Measurement and Deembedding Techniques for Crosstalk Study in Via Arrays Workshop
IEEE Workshop on Signal Propagation on Interconnects (SPI), Hildesheim, Germany, May 9-12, 2010.
In: IEEE Transactions on Electromagnetic Compatibility , Bd. 52, Nr. 2, 2010.
Fast and Concurrent Simulations for SI, PI, and EMI Analysis of Multilayer Printed Circuit Boards (invited) Proceedings Article
In: Asia-Pacific Symposium on EMC (APEMC), Beijing, China, April 12-16, 2010.
Schnelle Simulation verlustbehafteter Verbindungsstrukturen auf Leiterplatten auf der Grundlage quasianalytischer Via-Modelle und der Leitungstheorie Proceedings Article
In: Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit (EMV Düsseldorf), Düsseldorf, Germany, March 9-11, 2010.
Ausnutzung magnetischer Symmetrie bei der numerischen Analyse von Feldproblemen mit der schnellen Multipolmethode Proceedings Article
In: Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit (EMV Düsseldorf) , Düsseldorf, Germany, March 9-11, 2010.
Fast-Physics-Based Via and Trace Models for Signal and Power Integrity Co-Analysis Proceedings Article
In: IEC DesignCon Conference, Santa Clara, USA, February 1-4, 2010.
Special Session on Power Integrity Techniques: Contour Integral Method for Rapid Computation of Power/Ground Plane Impedance Proceedings Article
In: IEC DesignCon Conference, Santa Clara, USA, February 1-4, 2010.
2009
Comprehensive Multilayer Substrate Models for Co-Simulation of Power and Signal Integrity Proceedings Article
In: IMAPS 42th International Symposium on Microelectronics and Packaging, San Jose, California, USA, November 3-5, 2009.
Verfahren zur schnellen Lösung von großen Gleichungssystemen in der Momentenmethode Artikel
In: 2009, ISBN: 978-3-8322-8568-5.
In: Microwave and Optical Technology Letters, Bd. 51, Nr. 9, 2009.
EM Emission of Differential Signals Across Connected Printed Circuit Boards in the GHz Range Proceedings Article
In: IEEE International Symposium on Electromagnetic Compatibility, Austin, USA, August 17-21, 2009.
In: IEEE Transactions on Microwave Theory and Techniques, Bd. 57, Nr. 8, 2009.
Extraction of Broadband Error Boxes for Microprobes and Recessed Probe Launches for Measurement of Printed Circuit Board Structures Proceedings Article
In: IEEE Workshop on Signal Propagation on Interconnects (SPI), Strasbourg, France, May 12-15, 2009.
Differential to Common Mode Conversion Due to Asymmetric Ground Via Configurations Proceedings Article
In: IEEE Workshop on Signal Propagation on Interconnects (SPI), Strasbourg, France, May 12-15, 2009.
Extraction of Via-Plate Capacitance of an Eccentric Via by an Integral Approximation Method Artikel
In: IEEE Microwave and Wireless Components Letters, Bd. 19, Nr. 5, 2009.
Is 25 Gb/s On-Board Signaling Viable? Artikel
In: IEEE Transactions on Advanced Packaging, Bd. 32, Nr. 2, 2009.
Ein Beitrag zur PEEC-Methode und deren Hybridiesierung mit der Momentenmethode Promotionsarbeit
2009, ISBN: 978-3-8322-8181-6.
Bandwidth Study of Recessed Probe Launch Variations for Broadband Measurement of Embedded PCB Structures Proceedings Article
In: German Microwave Conference (GeMic), Munich, Germany, March 16-18, 2009.
Fully Analytical Methodology for Fast End-to-End Link Analysis on Complex Printed Circuit Boards including Signal and Power Integrity Effects. Proceedings Article
In: IEC DesignCon Conference, Santa Clara, USA, February 2-5, 2009.
Including Stripline Connections into Network Parameter Based Via Models for Fast Simulation of Interconnects Proceedings Article
In: International Zurich Symposium on Electromagnetic Compatibility, Switzerland, January 12-15, 2009.
2008
Eliminating Via-Plane Coupling Using Ground Vias for High-Speed Signal Transitions Proceedings Article
In: IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), San Jose, CA, USA, October 27-29, 2008.
Fast Analysis of Electromagnetic Field Coupling into PCBs based on the PEEC Method Proceedings Article
In: IEEE Symposium EMC Europe, Hamburg, Germany, September 8-12, 2008.
MoM-Based Analysis of the Immunity of Marine Equipment in a Control Cabinet of Cruise and Container Vessels against 2.4-GHz WLAN Application Proceedings Article
In: IEEE EMC Europe Hamburg, Germany, 2008.
Simple Load-Balancing in Binary-Tree Based Parallel Multilevel Low-Rank Compression Techniques Proceedings Article
In: IEEE International Symposium on Electromagnetic Compatibility (EMC), Detroit, USA, August 17-22, 2008.
The Viability of 25 Gb/s On-board Signaling Proceedings Article
In: Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, USA, May 27-30, 2008.