Efficient Prediction of Equalization Effort and Channel Performance for PCB-Based Data Links Artikel
IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (11), 2017.
High Frequency Characterization of Silicon Substrate and through Silicon Vias Inproceedings
Electronic Components and Technology Conference (ECTC), Las Vegas, US, May 31 – June 3, 2016.
A Rigorous Approach for the Rigorous Approach Using Multipole Expansions Artikel
IEEE Transactions on Components, Packaging and Manufacturing Technology, 6 (1), 2016.
Efficient Computation of Localized Fields for Through Silicon Via Modeling Up to 500 GHz Artikel
IEEE Transactions on Components, Packaging and Manufacturing Technology, 5 (12), 2015.
Comparison of Passivation Materials for High frequency 3D Packaging Application up to 110 GHz Inproceedings
2015 European Microelectronics Packaging Conference (EMPC), Friedrichshafen, Germany, September 14-16, 2015.
Efficient Analysis of Wave Propagation for Through-Silicon-Via Pairs using Multipole Expansion Method Workshop
2015 IEEE 19th Workshop on Signal and Power Integrity (SPI), Berlin, Germany, May 10-13, 2015.
An Efficient Analysis of Power/Ground Planes With Inhomogeneous Substrates Using the Contour Integral Method Artikel
IEEE Transactions on Electromagnetic Compatibility, 56 (4), 2014.
Energy-aware analysis of electrically long high speed I/O links Artikel
Computer Science – Research and Development, 29 (2), 2014.
Applying a physics-based via model for the simulation of Through Silicon Vias Inproceedings
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, USA, October 27-30, 2013.
Extensions to the Contour Integral Method for Efficient Modeling of TM Scattering in Two-Dimensional Photonic Crystals Inproceedings
7th International Congress on Advanced Electromagnetic Materials in Microwaves and Optics (Metamaterials’2013), Bordeaux, France, September 16-13, 2013.
Efficient DC Analysis of Power Planes Using Contour Integral Method With Circular Elements Artikel
IEEE Transactions on Components, Packaging and Manufacturing Technology, 3 (8), S. 1409 - 1419, 2013.
Application of the Transverse Resonance Method for Efficient Extraction of the Dispersion Relation of Arbitrary Layers in Silicon Interposers Workshop
IEEE Workshop on Signal and Power Integrity (SPI), Paris, France, May-12-15, 2013.
Signal and Power Integrity (SPI) Co-Analysis for High-Speed Communication Channels Inproceedings
UBM DesignCon Conference, Santa Clara, USA, January 28-31, 2013.
Accuracy of Physics-Based Via Models for Simulation of Dense Via Arrays Artikel
IEEE Transactions on Electromagnetic Compatibility, 54 (5), 2012.
Progress Towards a Combined CIM/MoM Approach for EMI Analysis of Electronic Systems Inproceedings
IEEE EMC Europe Symposium, Rome, Italy, September 17-21, 2012.
Energy-Aware Analysis of Electrically Long High Speed I/O Links Artikel
Computer Science – Research and Development, August 2012 and International Conference on Energy-Aware High Performance Computing (EnA-HPC), Hamburg, Germany, September 12, 2012.
Extension of the Contour Integral Method for the Electrical Design of Planar Structures in Digital Systems Promotionsarbeit
2012, ISBN: 978-3-8440-1059-6.
Circular Ports in Parallel-Plate Waveguide Analysis with Isotropic Excitations Artikel
IEEE Transactions on Electromagnetic Compatibility, 54 (3), 2012.
Extension of the Contour Integral Method to Anisotropic Modes on Circular Ports Artikel
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (2), 2012.
Impact of Multiple Scattering on Passivity of Equivalent-Circuit Via Models Inproceedings
IEEE Electrical Design of Advanced Package & Systems Symposium (EDAPS), Hangzhou, China, December 12-14, 2011.
Recent Developments of Via and Return Current Path Modeling (Invited) Inproceedings
International Conference on Electromagnetics in Advanced Applications (ICEAA), Torino, Italy, September 12-16, 2011.
A Hybrid CIM/MoM Approach for Power Plane Analysis Including Radiation Loss Inproceedings
Asia-Pacific EMC Symposium (APEMC), Jeju Island, Korea, May-16-19, 2011.
Non-Uniform Currents on Vias and Their Effects in a Parallel-Plate Environment Inproceedings
IEEE Electrical Design of Advanced Package & Systems Symposium (EDAPS), Singapore, December 7-9, 2010.
A Combined Method for Fast Analysis of Signal Propagation, Ground Noise, and Radiated Emission of Multilayer Printed Circuit Boards Artikel
IEEE Transactions on Electromagnetic Compatibility , 52 (2), 2010.
Fast and Concurrent Simulations for SI, PI, and EMI Analysis of Multilayer Printed Circuit Boards (invited) Inproceedings
Asia-Pacific Symposium on EMC (APEMC), Beijing, China, April 12-16, 2010.
Special Session on Power Integrity Techniques: Contour Integral Method for Rapid Computation of Power/Ground Plane Impedance Inproceedings
IEC DesignCon Conference, Santa Clara, USA, February 1-4, 2010.
Comprehensive Multilayer Substrate Models for Co-Simulation of Power and Signal Integrity Inproceedings
IMAPS 42th International Symposium on Microelectronics and Packaging, San Jose, California, USA, November 3-5, 2009.
EM Emission of Differential Signals Across Connected Printed Circuit Boards in the GHz Range Inproceedings
IEEE International Symposium on Electromagnetic Compatibility, Austin, USA, August 17-21, 2009.
Differential to Common Mode Conversion Due to Asymmetric Ground Via Configurations Workshop
IEEE Workshop on Signal Propagation on Interconnects (SPI), Strasbourg, France, May 12-15, 2009.