Electronic Design Flow Improvement with Machine Learning Tools

The design of modern printed circuit boards (PCBs) is a challenging task and requires the compliance with a variety of speci cations. To reduce the risk of a poor design and getting the desired functionality, the design processs is accompanied by many electromagnetic simulations. In combination with the time requirement of an individual simulaion this results in a large e ort which needs a lot of computational resources. Because future designs will have a higher complexity and larger integration level, decreasing the time requirement for an individual simulation is an important task to solve. Without improving the simulation mechanism the design ow will require more time which results in additional costs for the development. This project aims to improve the design ow by providing a more ecient design tool and process. In the area of machine learning algorithms some promising ideas are found. Publications in recent years provide methods to increase the eciency of optimization processes – for example generic algorithms for the placement of decoupling capacitors. With arti cial neural networks rst results are achieved by investigating the impedance of the power delivery network under the in uence of decoupling capacitors. Future work shall increase the applicability of arti cial neural networks to a wider range of simulation tasks. Therefore di erent aspects have to be investigated. The focus is on printed circuit boards which are commonly used in many electronic devices. The functionality and capabilities of printed circuit boards is well understood. One of the most important aspects within this project is to provide not only a faster simulation ow but to ensure the consistency of simulation results with existing tools and methods.

Typical multilayer printed circuit board with four layers. Two layers are for the power supply and two layers are for the signal transmission. By placing decoupling capacitors on the PCB the impedance of the power delivery network shall be improved. Multiple parameters (material constants and dimensions) are influencing
the eletrical behavior of the PCB.

The target impedance is violated by the impedance of the power delivery network, thereby the design is not suf icient. This fact can either be taken from a conventional simulations tool or with an arti cial neural network. Using arti cial neural networks is a promising idea. Depending on diff erent input parameters (material constants and dimensions) predictions of the electrical behavior are made.

Funding: Hamburg Electronics Lab for Integrated Optoelectronical Systems (HELIOS)
Contact: Morten Schierholz, M.Sc.
Start date: 01.12.2019

Python-based Simulation of Interconnect Performance and Link Bit Error Rates

The project PhyBER is used for the analysis of link topologies. It will be used for the simulation of statistical eye diagrams based on scattering parameters. The tool will support different line codings and signal shapes. Furthermore, channel coding will be available as well. It will be possible to include jitter and crosstalk in the analysis. The program also contains equalizers and algorithms for their optimization. An interface to metrics like the channel operating margin (COM) [1] will be present as well and could be used for an estimation of signal quality. With the help of the polynomial chaos expansion (PCE) [2] it will be possible to conduct a computational efficient sensitivity analysis. Using external python tools [3] neural networks can be trained and used for the prediction of link behavior.

Eye diagram without and with a CTLE.

General program structure of the PhyBER tool. The statistical eye diagram is simulated externally. After post-processing the results can be further analyzed by other tools.

Funding: Free and Hanseatic City of Hamburg
Contact: Katharina Scharff, M.Sc., Ömer Yildiz, M.Sc., Torben Wendt, M.Sc.
Start date: 01.04.2016

Sources:

[1] IEEE Std 802.3bj-2014 – IEEE Standard for Ethernet Amendment 2: Physical Layer Specifications and Management Parameters for 100 Gb/s Operation Over Backplanes and Copper Cables, IEEE Computer Society, September 2014[2] Feinberg, J. & Langtangen, H. P. Chaospy: An open source tool for designing methods of uncertainty quantification, Journal of Computational Science, Elsevier BV, 2015, 11, 46-57[3] https://www.tensorflow.org/

Application of Model Order Reduction Techniques to the Simulation of Complex Interconnect Systems

Interconnects in modern electronic systems constitute very dense and complex structures that demand highly efficient methodologies for their modeling and design. Even with semi-analytical or hybrid simulation approaches, the analysis of this type of systems often implies very large models and long execution times. This project, which is developed in collaboration with the Instituto Tecnológico de Costa Rica (ITCR), deals with the exploration of numerical techniques to facilitate the handling and processing of such complex models.

Different macromodeling techniques, such as vector fitting algorithms and matrix state representations, are being explored as an additional resource that can assist the handling, concatenation, and processing of interconnect models. Stochastic frequency-domain macromodels, combining the descriptor form representation for a dynamical system with the Polynomial Chaos Expansion technique, are also being analyzed. This will allow to include the variability analysis of the system for any frequency over a desired frequency range. To reduce the number of required samples, techniques for the analytical concatenation of macromodels in descriptor form will be adapted. Together with the use of semi-analytical techniques for the sample construction, this process should guarantee the accurate representation of complex multiport systems with different random input variables, within a short time. To evaluate the performance of these techniques, the comparison with purely numerical techniques will be addressed with realistic modeling scenarios.

Example of a Vector fitting approximation of an S-Parameter crosstalk model as a function of the number of poles.

Complex plane pole and zero constellation of a vector fitting (VF) macromodel as a function of the number of poles, extracted from a high-speed channel S-Parameter model.

Funding: Instituto Tecnologico de Costa Rica (ITCR)
Contact: Luis Ernesto Carrera Retana, M. Sc., Prof. Renato Rimolo-Donadio
Start date: 01.01.2017

Interconnects at 50-100 Gbps

The aim of the project is the study of digital links with data rates of 50 Gbps and higher.

Data rates of digital links are increasing constantly. This gives rise to effects that complicate error free signal propagation and sometimes render it impossible. Crosstalk occurs due to small distances between transmission lines. Furthermore, discontinuities lead to reflections, which interfere with the signal.

The goal is the characterization and the design of interconnects that allow for high data rates. By using different line codings signals with lower bandwidths are generated which makes them less sensitive to high-frequency disturbances. For the evaluation of the signal integrity tools that were developed at the institute and allow for a fast generation of eye diagrams are used as well as several commercial tools.

Data flow and concurrence of tools used in this study. Random jitter (RJ), sinusoidal jitter (SJ), as well as duty cycle distortion (DCD) are added as part of the transmitter as indicated.
Furthermore, a voltage swing of 1V and a slew rate of 44 ps applies. Source: TET, TUHH

Eye diagram of a 4-level pulse amplitude modulation (PAM4). Source: TET, TUHH

Funding: Free and Hanseatic City of Hamburg
Contact: Katharina Scharff, M.Sc.
Start Date: April 2016

Stochastic Contour Integral Methodology for the Computation of Two-Dimensional Electromagnetic Wave Propagation

David Dahl. DFG Project 01.08.2015 – 31.07.2018

The project will extend the so-called contour integral method (CIM) for the computation of two-dimensional packaging and interconnect structures such as printed circuit boards and planar optical substrates to take into account stochastic boundary conditions and simulation parameters. The stochastic contour integral method will be studied from a mathematical point of view, implemented in a numerically efficient way, and demonstrated with relevant application examples. To take into account stochastic boundary conditions and input parameters, the polynomial chaos expansion (PCE) known from other application areas will for the first time be applied in the context of a contour integral method for electrodynamics. For this purpose, a partially existing Fortran code will be extended by methods that can take into account statistical variations in the excitation as well as in the geometry and material parameters of the structure under investigation. On the one hand, a mathematical analysis of the stochastic contour integral methodology will be carried out, including demonstrations of the methodology with help of suitable examples and investigations with regard to the limitations of the numerical treatment. On the other hand, the methodology and the existing numerical code will be extended specifically for stochastic problems in the areas of microwave engineering and integrated planar optics. The potential of the methodology will be demonstrated by applying the extended code to structures that are relevant from an engineering point of view. By virtue of the cooperation between the Institute of Electromagnetic Theory and the Institute of Mathematics of the Hamburg University of Technology (TUHH) the project will facilitate fundamental research in mathematics and numerics in the context of a relevant and challenging application area in engineering.

The contour integral methods can be applied for the modeling of power distribution networks in printed circuit boards. The PCE can be used to study the influence of variations of the decoupling capacitor properties.

The contour integral method can be applied in planar optics for the efficient simulation of photonic crystals which can be used for building optical waveguides.

Related Publications:

David Dahl, Heinz-Dietrich Brüns, Lei Wang, Eduard Frick, Christian Seifert, Marko Lindner, Christian Schuster

Efficient Simulation of Substrate-Integrated Waveguide Antennas Using a Hybrid Boundary Element Method Journal Article

IEEE Journal on Multiscale and Multiphysics Computational Techniques, 4 , 2019.

Links

Till Hillebrecht, David Dahl, Christian Schuster

Prediction of Frequency Dependent Shielding Behavior for Ground Via Fences in Printed Circuit Boards Inproceedings

2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) Chambery, France, June 18-21, 2019.

Links

Ömer Faruk Yildiz, David Dahl, Christian Schuster

Quantifying the Impact of RF Probing Variability on TRL Calibration for LTCC Substrates Inproceedings

2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Las Vegas, USA, May 28-31, 2019.

Links

David Dahl, Eduard Frick, Christian Seifert, Marko Lindner, Christian Schuster

Multiscale Simulation of 2D Photonic Crystal Structures Using a Contour Integral Method Journal Article

IEEE Journal on Multiscale and Multiphysics Computational Techniques, 4 , 2019.

Links

Eduard Frick, David Dahl, Christian Seifert, Marko Lindner, Christian Schuster

An Intrusive PCE Extension of the Contour Integral Method and its Application in Electrical Engineering Inproceedings

Annual Meeting of the Gesellschaft für Angewandte Mathematik und Mechanik (GAMM), Vienna, Austria, February, 2019.

Eduard Frick, David Dahl, Christian Seifert, Marko Lindner, Christian Schuster

Novel method for error estimation in applications of polynomial chaos expansion to stochastic modeling of multi-resonant systems Inproceedings

2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) San Jose, CA, USA , 2018.

Links

Eduard Frick, David Dahl, Christian Seifert, Marko Lindner, Christian Schuster

Error Estimation in Applications of Polynomial Chaos Expansion to Stochastic Modeling of multi-Resonant Systems Inproceedings

IEEE Conference on Electrical Perfomance of Electronic Packaging and Systems (EPEPS) San Jose, USA, October, 2018.

Links

David Dahl

Electromagnetic Modeling and Optimization of Through Silicon Vias PhD Thesis

2018, ISBN: 978-3-8440-6009-6.

Katharina Scharff, David Dahl, Heinz-Dietrich Brüns, Christian Schuster

Physical Scaling Effects of Differential Crosstalk in Via Arrays up to Frequencies of 100 GHz Inproceedings

22nd IEEE Workshop on Signal and Power Integrity (SPI) Brest, France, May, 2018.

Links

David Dahl, Ömer Faruk Yildiz, Eduard Frick, Christian Seifert, Marko Lindner, Christian Schuster

Feasibility of Uncertainty Quantification for Power Distribution Network Modeling Using PCE and a Contour Integral Method Inproceedings

2018 Joint IEEE International Symposium on Electromagnetic Compatibility & Asia-Pacific Symposium on Electromagnetic Compatibility, Singapore, June, 2018.

Links

David Dahl, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

Effect of 3D Stack-Up Integration on Through Silicon Via Characteristics Workshop

IEEE Workshop on Signal and Power Integrity (SPI), Lake Maggiore (Baveno), Italy, May 7-10, 2017.

Links

David Dahl, Torsten Reuschel, Jan Birger Preibisch, Xiaomin Duan, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

Efficient Total Crosstalk Analysis of Large Via Arrays in Silicon Interposers Journal Article

IEEE Transactions on Components, Packaging and Manufacturing Technology, 6 (12), 2016.

Links

Torsten Reuschel, Miroslav Kotzev, David Dahl, Christian Schuster

Modeling of Differential Striplines in Segmented Simulation of Printed Circuit Board Link Inproceedings

IEEE Signal and Power Integrity Conference (SIPI 2016), Ottawa, ON, Canada, July 25-29, 2016.

Links

Xiaomin Duan, Mathias Boettcher, David Dahl, Christian Schuster, Christian Tschoban, Ivan Ndip, Klaus-Dieter Lang

High Frequency Characterization of Silicon Substrate and through Silicon Vias Inproceedings

Electronic Components and Technology Conference (ECTC), Las Vegas, US, May 31 – June 3, 2016.

Links

David Dahl, Torsten Reuschel, Xiaomin Duan, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

On the Upper Bound of Total Uncorrelated Crosstalk in Large Through Silicon Via Arrays Inproceedings

IEEE Workshop on Signal and Power Integrity (SPI) Turin, Italy, May 8-11, 2016.

Links

Xiaomin Duan, David Dahl, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

A Rigorous Approach for the Rigorous Approach Using Multipole Expansions Journal Article

IEEE Transactions on Components, Packaging and Manufacturing Technology, 6 (1), 2016.

Links

David Dahl, Xiaomin Duan, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

Efficient Computation of Localized Fields for Through Silicon Via Modeling Up to 500 GHz Journal Article

IEEE Transactions on Components, Packaging and Manufacturing Technology, 5 (12), 2015.

Links

Xiaomin Duan, Mathias Böttcher, Stephan Dobritz, David Dahl, Christian Schuster, Ivan Ndip, Klaus-Dieter Lang

Comparison of Passivation Materials for High frequency 3D Packaging Application up to 110 GHz Inproceedings

2015 European Microelectronics Packaging Conference (EMPC), Friedrichshafen, Germany, September 14-16, 2015.

Andreas Hardock, David Dahl, Heinz-Dietrich Brüns, Christian Schuster

Efficient Calculation of External Fringing Capacitances for Physics-Based PCB Modeling Workshop

2015 IEEE 19th Workshop on Signal and Power Integrity (SPI), Berlin, Germany, May 10-13, 2015.

Links

Xiaomin Duan, David Dahl, Christian Schuster, Ivan Ndip, Klaus-Dieter Lang

Efficient Analysis of Wave Propagation for Through-Silicon-Via Pairs using Multipole Expansion Method Workshop

2015 IEEE 19th Workshop on Signal and Power Integrity (SPI), Berlin, Germany, May 10-13, 2015.

Links

David Dahl, Sebastian Müller, Christian Schuster

Effect of Layered Media on the Parallel Plate Impedance of Printed Circuit Boards Inproceedings

EEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium, Bangalore, India, December 14-16, 2014.

David Dahl, Anne Beyreuther, Xiaomin Duan, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

Analysis of Wave Propagation along Coaxial Through Silicon Vias Using a Matrix Method Workshop

IEEE Workshop on Signal and Power Integrity (SPI), Ghent, Belgium, May 11-14, 2014.

Links

David Dahl, Xiaomin Duan, Anne Beyreuther, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

Applying a physics-based via model for the simulation of Through Silicon Vias Inproceedings

IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, USA, October 27-30, 2013.

Links

David Dahl, Xiaomin Duan, Anne Beyreuther, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

Application of the Transverse Resonance Method for Efficient Extraction of the Dispersion Relation of Arbitrary Layers in Silicon Interposers Workshop

IEEE Workshop on Signal and Power Integrity (SPI), Paris, France, May-12-15, 2013.

Links

Combined Assessment of Interconnect and Equalization in Data Links on Multilayer Printed Circuit Boards

Ph. D. Thesis Torsten Reuschel. 01.10.2013 – 15.10.2018

Increasing data rates and reduced design margins oppose a detailed consideration of the diverse aspects of high-speed digital links, such as the passive channel, equalization, and coding. This work offers novel methods for the computationally efficient design and validation of links. A combined system perspective is established based on predominant physical parameters of the interconnect and key parameters of equalizer design. This enables a systematic prediction of design constraints and is accompanied by a study of advanced uncertainty quantification methods for pre- and post-layout design.

Crosstalk distribution in large via-array at different frequencies. The simulation is carried out using the tool Multilayer Substrate Simulator, which is developed at the institute. (Source: TET, TUHH).

Exemplary interconnect between two large via-arrays. The striplines within the first cavity are indicated. The eye diagram is efficiently generated using statistical methods. (Source: TET, TUHH).

Related Publications:

Torsten Reuschel

Combined Assessment of Interconnect and Equalization in Data Links on Multilayer Printed Circuit Boards PhD Thesis

2019, ISBN: 978-3-8440-6499-5.

Torben Wendt, Torsten Reuschel, Christian Schuster

Direct Prediction of Linear Equalization Coefficients Using Raised Cosine Pulse Shaping in Frequency Domain Inproceedings

22nd IEEE Workshop on Signal and Power Integrity (SPI) Brest, France, May, 2018.

Links

Torsten Reuschel, Ömer Faruk Yildiz, Jayaprakash Balachandran, Cristian Filipa, Nitin Bhagwath, Bidyut Sen, Christian Schuster

Efficient Sensitivity-Aware Assessment of High-Speed Links Using PCE and Implications for COM Inproceedings

DesignCon, Santa Clara, CA, USA, January, 2018.

Torsten Reuschel, Jan Birger Preibisch, Katharina Scharff, Renato Rimolo-Donadio, Xiaomin Duan, Young H. Kwark, Christian Schuster

Efficient Prediction of Equalization Effort and Channel Performance for PCB-Based Data Links Journal Article

IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (11), 2017.

Links

Katharina Scharff, Torsten Reuschel, Xiaomin Duan, Heinz-Dietrich Brüns, Christian Schuster

Exploration of Differential Via Stub Effect Mitigation by Using PAM4 and PAM8 Line Coding Workshop

IEEE Workshop on Signal and Power Integrity (SPI), Lake Maggiore (Baveno), Italy, May 7-10, 2017.

Links

Torsten Reuschel, Jan Birger Preibisch, Christian Schuster

Efficient Design of Continuous Time Linear Equalization for Loss Dominated Digital Links Workshop

IEEE Workshop on Signal and Power Integrity (SPI), Lake Maggiore (Baveno), Italy, May 7-10, 2017.

Links

Benjamin Rohrdantz, Thomas Jaschke, Torsten Reuschel, Stefan Radzijewski, Arne F. Jacob

An Electronically Scannable Reflector Antenna Using a Planar Active Array Feed at Ka-Band Journal Article

IEEE Transactions on Microwave Theory and Techniques, 65 (5), 2017.

Yu Zhao, Rainer Grünheid, Gerhard Bauch, Torsten Reuschel, Christian Schuster

Redundant and Non-Redundant Spectrum Shaping Schemes for Reflection-Limited Chip-to-Chip Communication Inproceedings

International ITG Conference on Systems, Communication and Coding (SCC) Hamburg, Germany, February 6-9, 2017.

Jan Birger Preibisch, Jayaprakash Balachandran, Torsten Reuschel, Katharina Scharff, Bidyut Sen, Christian Schuster

Exploring Efficient Variability-Aware Analysis Method for High-Speed Digital Link Design Using PCE Inproceedings

UBM DesignCon Conference, Santa Clara, CA, USA, January 31 – February 2, 2017.

David Dahl, Torsten Reuschel, Jan Birger Preibisch, Xiaomin Duan, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

Efficient Total Crosstalk Analysis of Large Via Arrays in Silicon Interposers Journal Article

IEEE Transactions on Components, Packaging and Manufacturing Technology, 6 (12), 2016.

Links

Torsten Reuschel, J. Meischner

Ansatz zur Verbesserung des Vorstellungsvermögens elektromagnetischer Felder der Studierenden im Modul „Theoretische Elektrotechnik I: Zeitunabhängige Felder“ Journal Article

Praxisprojekte des Qualifizierungsprogramms „Forschendes Lernen an der TUHH“, Ausgabe 2. Hamburg, Germany: Zentrum für Lehre und Lernen, Technische Universität Hamburg, 2016.

Alexander Vogt, Torsten Reuschel, Heinz-Dietrich Brüns, Sabine Le Borne, Christian Schuster

On the Treatment of Arbitrary Boundary Conditions Using a Fast Direct H-Matrix Solver in MoM Journal Article

IEEE Transactions on Antennas and Propagation, 64 (8), 2016.

Links

Torsten Reuschel, Miroslav Kotzev, David Dahl, Christian Schuster

Modeling of Differential Striplines in Segmented Simulation of Printed Circuit Board Link Inproceedings

IEEE Signal and Power Integrity Conference (SIPI 2016), Ottawa, ON, Canada, July 25-29, 2016.

Links

David Dahl, Torsten Reuschel, Xiaomin Duan, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

On the Upper Bound of Total Uncorrelated Crosstalk in Large Through Silicon Via Arrays Inproceedings

IEEE Workshop on Signal and Power Integrity (SPI) Turin, Italy, May 8-11, 2016.

Links

Jan Birger Preibisch, Torsten Reuschel, Katharina Scharff, Christian Schuster

Impact of Continuous Time Linear Equalizer Variability on Eye Opening of High-Speed Links Inproceedings

IEEE Workshop on Signal and Power Integrity (SPI), Turin, Italy, May 8-11, 2016.

Links

Torsten Reuschel, Sebastian Müller, Christian Schuster

Segmented Physics-Based Modeling of Multilayer Printed Circuit Boards Using Stripline Port Journal Article

IEEE Transactions on Electromagnetic Compatibility, 58 (1), 2016.

Links

Young H. Kwark, Torsten Reuschel, Renato Rimolo-Donadio, Dierk Kaller, Thomas-Michael Winkel, Hubert Harrer, Christian Schuster

Systematic analysis of electrical link bottlenecks and strategies for their equalization Inproceedings

DesignCon, Santa Clara, CA, USA, 19. -21. January , 2016.

Sebastian Müller, Torsten Reuschel, Renato Rimolo-Donadio, Young H. Kwark, Heinz-Dietrich Brüns, Christian Schuster

Energy-Aware Signal Integrity Analysis for High-Speed PCB Links Journal Article

IEEE Transactions on Electromagnetic Compatibility, 57 (5), 2015.

Links

Torsten Reuschel, Sebastian Müller, Heinz-Dietrich Brüns, Christian Schuster

Investigation of Long Range Differential Crosstalk on Printed Circuit Boards Workshop

EEE Workshop on Signal and Power Integrity (SPI), Ghent, Belgium, May 11-14, 2014.

Links

Electromagnetic Modeling and Optimization of Through Silicon Vias

Ph. D. Thesis David Dahl. 01.10.2012 – 13.12.2017

This thesis presents the simulation and the design of vertical interconnects in silicon substrates known as through silicon vias (TSVs) which are applied as a component of 3D integration of integrated circuits. Numerical methods of comparably high efficiency are developed and applied in order to simulate the electromagnetic properties of large realistic arrays of TSVS. The proposed methods are correlated with alternative methods and parameter variations are carried out to derive design guidelines. Further, several test structures with TSV are developed and the measurement results are correlated with the results from electromagnetic simulations.

Schematic layout of a part of a silicon interposer where Through Silicon Vias (TSV) establish a connection between top and bottom of the structure. The metallic barrels of typically circular cross-section are electrically isolated from the conductive silicon substrate material by a thin silicon dioxide layer. Two principle types of wave propagation are investigated. (Source: TET, TUHH).

A physics-based via model assuming metallic boundaries on top and bottom of the interposer structure. The near field effects are modeled by lumped capacitances while wave propagation in the cavity constituted by the substrate and the enclosing metallic layers is represented by the “parallel plate impedance”. (Source: TET, TUHH).

Related Publications:

David Dahl, Heinz-Dietrich Brüns, Lei Wang, Eduard Frick, Christian Seifert, Marko Lindner, Christian Schuster

Efficient Simulation of Substrate-Integrated Waveguide Antennas Using a Hybrid Boundary Element Method Journal Article

IEEE Journal on Multiscale and Multiphysics Computational Techniques, 4 , 2019.

Links

Till Hillebrecht, David Dahl, Christian Schuster

Prediction of Frequency Dependent Shielding Behavior for Ground Via Fences in Printed Circuit Boards Inproceedings

2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) Chambery, France, June 18-21, 2019.

Links

Ömer Faruk Yildiz, David Dahl, Christian Schuster

Quantifying the Impact of RF Probing Variability on TRL Calibration for LTCC Substrates Inproceedings

2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Las Vegas, USA, May 28-31, 2019.

Links

David Dahl, Eduard Frick, Christian Seifert, Marko Lindner, Christian Schuster

Multiscale Simulation of 2D Photonic Crystal Structures Using a Contour Integral Method Journal Article

IEEE Journal on Multiscale and Multiphysics Computational Techniques, 4 , 2019.

Links

Eduard Frick, David Dahl, Christian Seifert, Marko Lindner, Christian Schuster

An Intrusive PCE Extension of the Contour Integral Method and its Application in Electrical Engineering Inproceedings

Annual Meeting of the Gesellschaft für Angewandte Mathematik und Mechanik (GAMM), Vienna, Austria, February, 2019.

Eduard Frick, David Dahl, Christian Seifert, Marko Lindner, Christian Schuster

Novel method for error estimation in applications of polynomial chaos expansion to stochastic modeling of multi-resonant systems Inproceedings

2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) San Jose, CA, USA , 2018.

Links

Eduard Frick, David Dahl, Christian Seifert, Marko Lindner, Christian Schuster

Error Estimation in Applications of Polynomial Chaos Expansion to Stochastic Modeling of multi-Resonant Systems Inproceedings

IEEE Conference on Electrical Perfomance of Electronic Packaging and Systems (EPEPS) San Jose, USA, October, 2018.

Links

David Dahl

Electromagnetic Modeling and Optimization of Through Silicon Vias PhD Thesis

2018, ISBN: 978-3-8440-6009-6.

Katharina Scharff, David Dahl, Heinz-Dietrich Brüns, Christian Schuster

Physical Scaling Effects of Differential Crosstalk in Via Arrays up to Frequencies of 100 GHz Inproceedings

22nd IEEE Workshop on Signal and Power Integrity (SPI) Brest, France, May, 2018.

Links

David Dahl, Ömer Faruk Yildiz, Eduard Frick, Christian Seifert, Marko Lindner, Christian Schuster

Feasibility of Uncertainty Quantification for Power Distribution Network Modeling Using PCE and a Contour Integral Method Inproceedings

2018 Joint IEEE International Symposium on Electromagnetic Compatibility & Asia-Pacific Symposium on Electromagnetic Compatibility, Singapore, June, 2018.

Links

David Dahl, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

Effect of 3D Stack-Up Integration on Through Silicon Via Characteristics Workshop

IEEE Workshop on Signal and Power Integrity (SPI), Lake Maggiore (Baveno), Italy, May 7-10, 2017.

Links

David Dahl, Torsten Reuschel, Jan Birger Preibisch, Xiaomin Duan, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

Efficient Total Crosstalk Analysis of Large Via Arrays in Silicon Interposers Journal Article

IEEE Transactions on Components, Packaging and Manufacturing Technology, 6 (12), 2016.

Links

Torsten Reuschel, Miroslav Kotzev, David Dahl, Christian Schuster

Modeling of Differential Striplines in Segmented Simulation of Printed Circuit Board Link Inproceedings

IEEE Signal and Power Integrity Conference (SIPI 2016), Ottawa, ON, Canada, July 25-29, 2016.

Links

Xiaomin Duan, Mathias Boettcher, David Dahl, Christian Schuster, Christian Tschoban, Ivan Ndip, Klaus-Dieter Lang

High Frequency Characterization of Silicon Substrate and through Silicon Vias Inproceedings

Electronic Components and Technology Conference (ECTC), Las Vegas, US, May 31 – June 3, 2016.

Links

David Dahl, Torsten Reuschel, Xiaomin Duan, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

On the Upper Bound of Total Uncorrelated Crosstalk in Large Through Silicon Via Arrays Inproceedings

IEEE Workshop on Signal and Power Integrity (SPI) Turin, Italy, May 8-11, 2016.

Links

Xiaomin Duan, David Dahl, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

A Rigorous Approach for the Rigorous Approach Using Multipole Expansions Journal Article

IEEE Transactions on Components, Packaging and Manufacturing Technology, 6 (1), 2016.

Links

David Dahl, Xiaomin Duan, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

Efficient Computation of Localized Fields for Through Silicon Via Modeling Up to 500 GHz Journal Article

IEEE Transactions on Components, Packaging and Manufacturing Technology, 5 (12), 2015.

Links

Xiaomin Duan, Mathias Böttcher, Stephan Dobritz, David Dahl, Christian Schuster, Ivan Ndip, Klaus-Dieter Lang

Comparison of Passivation Materials for High frequency 3D Packaging Application up to 110 GHz Inproceedings

2015 European Microelectronics Packaging Conference (EMPC), Friedrichshafen, Germany, September 14-16, 2015.

Andreas Hardock, David Dahl, Heinz-Dietrich Brüns, Christian Schuster

Efficient Calculation of External Fringing Capacitances for Physics-Based PCB Modeling Workshop

2015 IEEE 19th Workshop on Signal and Power Integrity (SPI), Berlin, Germany, May 10-13, 2015.

Links

Xiaomin Duan, David Dahl, Christian Schuster, Ivan Ndip, Klaus-Dieter Lang

Efficient Analysis of Wave Propagation for Through-Silicon-Via Pairs using Multipole Expansion Method Workshop

2015 IEEE 19th Workshop on Signal and Power Integrity (SPI), Berlin, Germany, May 10-13, 2015.

Links

David Dahl, Sebastian Müller, Christian Schuster

Effect of Layered Media on the Parallel Plate Impedance of Printed Circuit Boards Inproceedings

EEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium, Bangalore, India, December 14-16, 2014.

David Dahl, Anne Beyreuther, Xiaomin Duan, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

Analysis of Wave Propagation along Coaxial Through Silicon Vias Using a Matrix Method Workshop

IEEE Workshop on Signal and Power Integrity (SPI), Ghent, Belgium, May 11-14, 2014.

Links

David Dahl, Xiaomin Duan, Anne Beyreuther, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

Applying a physics-based via model for the simulation of Through Silicon Vias Inproceedings

IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, USA, October 27-30, 2013.

Links

David Dahl, Xiaomin Duan, Anne Beyreuther, Ivan Ndip, Klaus-Dieter Lang, Christian Schuster

Application of the Transverse Resonance Method for Efficient Extraction of the Dispersion Relation of Arbitrary Layers in Silicon Interposers Workshop

IEEE Workshop on Signal and Power Integrity (SPI), Paris, France, May-12-15, 2013.

Links

Software-Benchmarking for Signal and Power Integrity Applications

Industry Project. 01.03.2012 – 31.12.2014

The Institute of Electromagnetic Theory is evaluating SPEAG’s SEMCAD software, a FDTD based field solver, with respect to typical problems in signal and power integrity design of digital systems. Schmid & Partner Engineering AG (SPEAG) is a Zurich based company that develops and manufactures advanced numerical tools and instrumentation for evaluation of electromagnetic near- and far-fields from static to optical frequencies. SPEAG focuses on evaluation and optimization of EM fields in complex environments such as close to and within the human body. Typical applications include EM safety and design optimization of mobile phones, MRI, and medical implants.

Below is a benchmark from electronic packaging: A ball grid array (BGA) socket model consisting of approx. 28 million cells. Reflection, transmission, and crosstalk parameters were extracted in the frequency domain up to 40 GHz from time domain data. It can be seen that the crosstalk reaches a maximum in the frequency range from 10 to 15 GHz.

SEMCAD model of ball grid array socket.

S-parameters obtained from SEMCAD simulations.

A second benchmark is the silicon interposer below with a pair of through silicon vias (TSVs) consisting of about 1 million cells. Results from time domain simulation using two digital pulses for excitation are shown. It can be seen that the TSVs shows mostly inductive reflection and produce crosstalk during rise and fall times.

SEMCAD model of silicon interposer with through silicon vias.

Time domain results from SEMACD simulation.

50+ Gbps High Speed Serial Link Design for Digital Systems

Industry Project. 01.08.2014 – 31.10.2014

High speed serial link design for digital systems is rapidly approaching the 25-50 Gbps data rate and is likely to move beyond in the next decade as can be seen e.g. from the recent 56 Gbps Common Electrical Interface (CEI) initiative of the Optical Internetworking Forum (OIF). With the increase in data rate problems in the areas of signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC) will exacerbate and require more attention than before in order to achieve a system that is not threatened in its electrical integrity (see figure below).
In this research project the Institute of Electromagnetic Theory was investigating on behalf of HUAWEI Research Europe the state of the art, the technical issues, and the necessary steps for electrical integrity at such advanced data rates. Specifically the following research areas were addressed in detail

– basic elements of successful link design methodologies,
– necessary CAD tools for link design,
– specific problems and challenges at 50+ Gbps signaling,
– suitable packaging & interconnect structures for 50+ Gbps signaling,
– most important research areas in the near future.

The results were summarized in a White Paper and presented at HUAWEI.

The concept of electrical integrity for digital systems: Typically, three aspects of electrical integrity are distinguished (left): power integrity, signal integrity, and electromagnetic compatibility. Although the three aspects have different objectives and use different methodologies, they are closely interlinked. The schematic at the right side of the figure illustrates the target domains of the different aspects, which can roughly be described as follows: Power integrity is concerned with providing a noise free power supply, signal integrity is concerned with the quality of signal transmission, and the electromagnetic compatibility is concerned with mitigating electromagnetic interference.

Via Array Modeling for Application in Fast, Energy-Efficient Digital Systems

Ph. D. Thesis Sebastian Müller. 01.04.2010 – 31.07.2014

This thesis studies the application of physics-based via models for an efficient modeling of large via arrays in multiglayer PCBs. Three main aspects are addressed: the study and improvement of the modeling accuray, the study and improvement of the model efficiency, and the application of the model in a systematic evaluation of via array design alternatives for high speed links.

With regard to the modeling accuracy, the application of an improved local field model is identified as a suitable way to improve the model accuraxy for the simulation of via arrays, especially at frequencies above 20 GHz. With the improved model, an accurate simulation of via arrays with a pitch of 60 mil or larger becomes possible in the frequency range up to 50 GHz. Improvements with regard to the model efficiency lead to a reduction of calculation times which allows to carry out fast design explorations for smaller via arrays on a stadard PC. Finally, an approach for the systematic design ebaluation is presented which intefrates the adventages of the efficient physics-based via model in a larger concept. With the approach, a quantitative comparison of design alternatives bevomes possible that takes into account the impact of design changes on both signal integrity and energy efficiency for the complete system.

(Source: TET, TUHH).

(Source: TET, TUHH).

Related Publications:

Torsten Reuschel, Sebastian Müller, Christian Schuster

Segmented Physics-Based Modeling of Multilayer Printed Circuit Boards Using Stripline Port Journal Article

IEEE Transactions on Electromagnetic Compatibility, 58 (1), 2016.

Links

Sebastian Müller, Torsten Reuschel, Renato Rimolo-Donadio, Young H. Kwark, Heinz-Dietrich Brüns, Christian Schuster

Energy-Aware Signal Integrity Analysis for High-Speed PCB Links Journal Article

IEEE Transactions on Electromagnetic Compatibility, 57 (5), 2015.

Links

David Dahl, Sebastian Müller, Christian Schuster

Effect of Layered Media on the Parallel Plate Impedance of Printed Circuit Boards Inproceedings

EEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium, Bangalore, India, December 14-16, 2014.

Sebastian Müller

Including multiconductor transmission lines in a quasi-analytical model for multilayer structures PhD Thesis

2014, ISBN: 978-3-8440-3360-1.

Miroslav Kotzev, Young H. Kwark, Sebastian Müller, Andreas Hardock, Renato Rimolo-Donadio, Christian W. Baks, Christian Schuster

High Frequency Measurement Techniques for Vias in Printed Circuit Boards Journal Article

IEEE Electromagnetic Compatibility Magazine, 3 (4), 2014.

Links

Torsten Reuschel, Sebastian Müller, Heinz-Dietrich Brüns, Christian Schuster

Investigation of Long Range Differential Crosstalk on Printed Circuit Boards Workshop

EEE Workshop on Signal and Power Integrity (SPI), Ghent, Belgium, May 11-14, 2014.

Links

Sebastian Müller, Xiaomin Duan, Christian Schuster

Energy-aware analysis of electrically long high speed I/O links Journal Article

Computer Science – Research and Development, 29 (2), 2014.

Sebastian Müller, Heinz-Dietrich Brüns, Christian Schuster

Einfluss der Routinglage in Via-Arrays auf die Signalqualität bei hohen Datenraten Inproceedings

Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit (EMV Düsseldorf) , Düsseldorf, Germany, March 11-13, 2014.

Andreas Hardock, Renato Rimolo-Donadio, Sebastian Müller, Young H. Kwark, Christian Schuster

Signal integrity: Efficient, physics-based via modeling: Return path, impedance, and stub effect control Journal Article

IEEE Electromagnetic Compatibility Magazine, 3 (1), 2014.

Links

Sebastian Müller, Andreas Hardock, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Analytical Extraction of Via Near-Field Coupling Using a Multiple Scattering Approach Workshop

EEE Workshop on Signal and Power Integrity (SPI) Paris, Frankreich, 2013.

Links

Sebastian Müller, Fabian Happ, Xiaomin Duan, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Complete Modeling of Large Via Constellations in Multilayer Printed Circuit Boards Journal Article

IEEE Transactions on Components, Packaging and Manufacturing Technology, 3 (3), 2013.

Renato Rimolo-Donadio, Xiaomin Duan, Young H. Kwark, Xiaoxiong Gu, Christian W. Baks, Sebastian Müller, Thomas-Michael Winkel, Thomas Strach, Lei Shan, Hubert Harrer, Christian Schuster

Signal and Power Integrity (SPI) Co-Analysis for High-Speed Communication Channels Inproceedings

UBM DesignCon Conference, Santa Clara, USA, January 28-31, 2013.

Andreas Hardock, Sebastian Müller, Xiaomin Duan, Heinz-Dietrich Brüns, Christian Schuster

Minimizing Displacement Return Currents in Multilayer Via Structures Inproceedings

IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Tempe, USA, October 21-24, 2012.

Links

Sebastian Müller, Xiaomin Duan, Miroslav Kotzev, Yaojiang Zhang, Jun Fan, Xiaoxiong Gu, Young H. Kwark, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Accuracy of Physics-Based Via Models for Simulation of Dense Via Arrays Journal Article

IEEE Transactions on Electromagnetic Compatibility, 54 (5), 2012.

Links

Sebastian Müller, Xiaomin Duan, Christian Schuster

Energy-Aware Analysis of Electrically Long High Speed I/O Links Journal Article

Computer Science – Research and Development, August 2012 and International Conference on Energy-Aware High Performance Computing (EnA-HPC), Hamburg, Germany, September 12, 2012.

Links

Renato Rimolo-Donadio, Sebastian Müller, Xiaomin Duan, Miroslav Kotzev, Heinz-Dietrich Brüns, Christian Schuster

Efficient, Physics-Based Via Modeling: Integration of Striplines (invited) Journal Article

IEEE Electromagnetic Compatibility Magazine, 1 (2), 2012.

Sebastian Müller, Renato Rimolo-Donadio, Xiaomin Duan, Heinz-Dietrich Brüns, Christian Schuster

Analytical Calculation of Conduction and Displacement Current Contributions in PCB Return Current Paths Inproceedings

Asia-Pacific EMC Symposium (APEMC), Singapore, May 21-24, 2012.

Links

Sebastian Müller, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Anwendung quasianalytischer Via-Modelle zur schnellen Simulation dichter Via-Arrays Inproceedings

Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit (EMV Düsseldorf), Düsseldorf, Germany, February 7-9, 2012.

Xiaoxiong Gu, Young H. Kwark, Dazhao Liu, Yaojiang Zhang, Jun Fan, Renato Rimolo-Donadio, Sebastian Müller, Christian Schuster, Francesco de Paulis

Backplane Channel Design Optimization: Recasting a 3Gb/s Link to Operate at 25Gb/s and Above Inproceedings

UBM DesignCon Conference, Santa Clara, CA, USA, January 30-February 2, 2012.

Xiaomin Duan, Renato Rimolo-Donadio, Sebastian Müller, Kijan Han, Xiaoxiong Gu, Young H. Kwark, Heinz-Dietrich Brüns, Christian Schuster

Impact of Multiple Scattering on Passivity of Equivalent-Circuit Via Models Inproceedings

IEEE Electrical Design of Advanced Package & Systems Symposium (EDAPS), Hangzhou, China, December 12-14, 2011.

Links

Sebastian Müller, Xiaomin Duan, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Recent Developments of Via and Return Current Path Modeling (Invited) Inproceedings

International Conference on Electromagnetics in Advanced Applications (ICEAA), Torino, Italy, September 12-16, 2011.

Xiaoxiong Gu, Young H. Kwark, Yaojiang Zhang, Jun Fan, Albert Ruehli, Miroslav Kotzev, Sebastian Müller, Renato Rimolo-Donadio, Christian Schuster, Bruce Archambeault

Validation and Application of Physics-based Via Models to Dense Via Arrays Inproceedings

IEC DesignCon Conference, Santa Clara, USA, January 31-February 3, 2011.

Sebastian Müller, Xiaomin Duan, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Non-Uniform Currents on Vias and Their Effects in a Parallel-Plate Environment Inproceedings

IEEE Electrical Design of Advanced Package & Systems Symposium (EDAPS), Singapore, December 7-9, 2010.

Links

Sebastian Müller, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Effect of Mixed-Reference Planes on Single-Ended and Differential Links in Multilayer Substrates Workshop

IEEE Workshop on Signal Propagation on Interconnects (SPI), Hildesheim, Germany, May 9-12, 2010.

Links

Sebastian Müller, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Schnelle Simulation verlustbehafteter Verbindungsstrukturen auf Leiterplatten auf der Grundlage quasianalytischer Via-Modelle und der Leitungstheorie Inproceedings

Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit (EMV Düsseldorf), Düsseldorf, Germany, March 9-11, 2010.

Exploration of Power Supply Noise Effects on Maximum Data Rates of High Speed Digital Links in Advanced Server Systems

Industry Project. 18.06.2010 – 17.06.2013

High speed digital links in IBM’s server systems today are running at data rates of up to 10 Gigabit per second (Gbps). These links are crucial for the overall performance of the system and are carefully designed with respect to signal integrity and bit error rates. The design process follows an iterative procedure in which I/O circuit designers and package designers collectively optimize the link performance using appropriate models for each element of the communication system. As data rates increase in next generation platforms to exceed 12 Gbps, the fundamental noise coupling mechanisms will change making a localized nearest neighbour analysis less relevant. Newer architectures are also increasingly relying on differential links to provide a measure of noise rejection. Increasing data rates will involve new noise coupling mechanisms, many of which are increasingly sensitive to skew, power supply noise, and return current path discontinuities.

IBM Watson Supercomputer based on Power7 (Source: IBM)

Transistors on IBM Power6 Chip (Source: IBM)

The design process for high speed digital links is nowadays focused on the assessment of signal interconnect performance. Power delivery network design is usually a separate effort and its implications for signal quality and maximum achievable data rates are not routinely studied or accurately quantified. In this joint research project the Institute of Electromagnetic Theory in close collaboration with a team from IBM Germany Research & Development explored the effect of power supply noise on the maximum achievable data rates in IBM’s high speed digital links. The team developed successfully a power delivery model for packaging structures and a method for inclusion of simultaneous switching noise into the link budget simulation.

Simulated eye diagram for a high speed digital link.

Simulated eye diagram subject to power supply noise.

Related Publications:

Christian Schuster, Renato Rimolo-Donadio

Modeling of Power Supply Noise Effects on High Speed Interconnects Workshop

EMC Symposium (APEMC), Melbourne, Australia, Mai 20-23, 2013.

Renato Rimolo-Donadio, Xiaomin Duan, Young H. Kwark, Xiaoxiong Gu, Christian W. Baks, Sebastian Müller, Thomas-Michael Winkel, Thomas Strach, Lei Shan, Hubert Harrer, Christian Schuster

Signal and Power Integrity (SPI) Co-Analysis for High-Speed Communication Channels Inproceedings

UBM DesignCon Conference, Santa Clara, USA, January 28-31, 2013.

Thomas-Michael Winkel, Hubert Harrer, Thomas Strach, Renato Rimolo-Donadio, Young H. Kwark, Xiaomin Duan, Christian Schuster

Framework for Co-Simulation of Signal and Power Integrity in Server Systems Inproceedings

IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Tempe, USA, October 21-24, 2012.

Links

Dion Timmermann, Renato Rimolo-Donadio, Young H. Kwark, Thomas-Michael Winkel, Claudio Siviero, Hubert Harrer, Christian Schuster

Methods for Calculation of Eye Diagrams for Digital Links with Multiple Aggressors Having Unknown Time Offsets Workshop

IEEE Workshop on Signal and Power Integrity (SPI), Sorrento, Italy, May 13-16, 2012.

Links

Development, Validation and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates

Ph. D. Thesis Renato Rimolo-Donadio. 01.11.2006 – 31.12.2010

This project deals with the efficient modeling and simulation of multilayer substrates in high-speed electronic systems.
Semi-analytical models for vias and traces in packages and printed circuit boards are proposed and incorporated into a framework for automatic simulation of multilayer structures. The models are validated with general-purpose numerical methods for electromagnetic simulation and measurements, using typical configurations such as differential and single-ended links. Application scenarios of realistic complexity for signal integrity, power integrity, and electromagnetic compatibility are evaluated and the co-simulation of these three domains is explored.

TUHH Universitätsbibliothek. TUBDok Link: http://doku.b.tu-harburg.de/volltexte/2011/1091

(Source: TET, TUHH).

(Source: TET, TUHH).

Related Publications:

Allan Carmona-Cruz, Katharina Scharff, Jonathan Cedeno-Chaves, Heinz-Dietrich Brüns, Renato Rimolo-Donadio, Christian Schuster

Via Transition Optimization Using a Domain Decomposition Approach Inproceedings

2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) Chambery, France, June 18-21, 2019.

Links

Jonathan Cedeno-Chaves, Katharina Scharff, Allan Carmona-Cruz, Heinz-Dietrich Brüns, Renato Rimolo-Donadio, Christian Schuster

Mode Conversion Due To Residual Via Stubs in Differential Signaling Inproceedings

IEEE Workshop on Signal and Power Integrity (SPI) Chambery, France, June 18-21, 2019.

Links

Luis Ernesto Carrera-Retana, Renato Rimolo-Donadio, Christian Schuster

Efficient Construction of Interconnect Passive Macromodels Through Segmented Analysis Inproceedings

2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2018.

Links

Torsten Reuschel, Jan Birger Preibisch, Katharina Scharff, Renato Rimolo-Donadio, Xiaomin Duan, Young H. Kwark, Christian Schuster

Efficient Prediction of Equalization Effort and Channel Performance for PCB-Based Data Links Journal Article

IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (11), 2017.

Links

Luis Ernesto Carrera-Retana, Renato Rimolo-Donadio, Christian Schuster

Evaluation of Vector Fitting for Compact Interconnect Model Representation Inproceedings

IEEE Convention of Central America and Panama Region (CONCAPAN) San Jose, Costa Rica, 2016.

Links

Young H. Kwark, Torsten Reuschel, Renato Rimolo-Donadio, Dierk Kaller, Thomas-Michael Winkel, Hubert Harrer, Christian Schuster

Systematic analysis of electrical link bottlenecks and strategies for their equalization Inproceedings

DesignCon, Santa Clara, CA, USA, 19. -21. January , 2016.

Sebastian Müller, Torsten Reuschel, Renato Rimolo-Donadio, Young H. Kwark, Heinz-Dietrich Brüns, Christian Schuster

Energy-Aware Signal Integrity Analysis for High-Speed PCB Links Journal Article

IEEE Transactions on Electromagnetic Compatibility, 57 (5), 2015.

Links

Miroslav Kotzev, Young H. Kwark, Sebastian Müller, Andreas Hardock, Renato Rimolo-Donadio, Christian W. Baks, Christian Schuster

High Frequency Measurement Techniques for Vias in Printed Circuit Boards Journal Article

IEEE Electromagnetic Compatibility Magazine, 3 (4), 2014.

Links

Andreas Hardock, Young H. Kwark, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Using Via Stubs in Periodic Structures for Microwave Filter Design Journal Article

IEEE Transactions on Components, Packaging and Manufacturing Technology, 4 (7), 2014.

Links

Andreas Hardock, Renato Rimolo-Donadio, Sebastian Müller, Young H. Kwark, Christian Schuster

Signal integrity: Efficient, physics-based via modeling: Return path, impedance, and stub effect control Journal Article

IEEE Electromagnetic Compatibility Magazine, 3 (1), 2014.

Links

Andreas Hardock, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Application of Vias as Functional Elements in Microwave Coupling Structures Journal Article

IEEE Transactions on Microwave Theory and Techniques, 61 (10), 2013.

Links

Sebastian Müller, Andreas Hardock, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Analytical Extraction of Via Near-Field Coupling Using a Multiple Scattering Approach Workshop

EEE Workshop on Signal and Power Integrity (SPI) Paris, Frankreich, 2013.

Links

Sebastian Müller, Fabian Happ, Xiaomin Duan, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Complete Modeling of Large Via Constellations in Multilayer Printed Circuit Boards Journal Article

IEEE Transactions on Components, Packaging and Manufacturing Technology, 3 (3), 2013.

Miroslav Kotzev, Renato Rimolo-Donadio, Young H. Kwark, Christian W. Baks, Xiaoxiong Gu, Christian Schuster

Electrical Performance of the Recessed Probe Launch Technique for Measurement of Embedded Multilayer Structures Journal Article

IEEE Transactions on Instrumentation and Measurement, 61 (12), 2012.

Links

Sebastian Müller, Xiaomin Duan, Miroslav Kotzev, Yaojiang Zhang, Jun Fan, Xiaoxiong Gu, Young H. Kwark, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Accuracy of Physics-Based Via Models for Simulation of Dense Via Arrays Journal Article

IEEE Transactions on Electromagnetic Compatibility, 54 (5), 2012.

Links

Renato Rimolo-Donadio, Sebastian Müller, Xiaomin Duan, Miroslav Kotzev, Heinz-Dietrich Brüns, Christian Schuster

Efficient, Physics-Based Via Modeling: Integration of Striplines (invited) Journal Article

IEEE Electromagnetic Compatibility Magazine, 1 (2), 2012.

Xiaomin Duan, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Circular Ports in Parallel-Plate Waveguide Analysis with Isotropic Excitations Journal Article

IEEE Transactions on Electromagnetic Compatibility, 54 (3), 2012.

Links

Andreas Hardock, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Double Stub Matching in Multilayered Printed Circuit Board using Vias Inproceedings

Electronic Components and Technology Conference (ECTC), San Diego, USA, May 29-June 1, 2012.

Links

Sebastian Müller, Renato Rimolo-Donadio, Xiaomin Duan, Heinz-Dietrich Brüns, Christian Schuster

Analytical Calculation of Conduction and Displacement Current Contributions in PCB Return Current Paths Inproceedings

Asia-Pacific EMC Symposium (APEMC), Singapore, May 21-24, 2012.

Links

Renato Rimolo-Donadio, Jochen Supper, Thomas-Michael Winkel, Hubert Harrer, Christian Schuster

Analysis and Mitigation of Parasitic Mode Conversion for Microstrip to Stripline Transitions Journal Article

IEEE Transactions on Electromagnetic Compatibility, 54 (2), 2012.

Links

Sebastian Müller, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Anwendung quasianalytischer Via-Modelle zur schnellen Simulation dichter Via-Arrays Inproceedings

Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit (EMV Düsseldorf), Düsseldorf, Germany, February 7-9, 2012.

Xiaomin Duan, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Extension of the Contour Integral Method to Anisotropic Modes on Circular Ports Journal Article

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (2), 2012.

Links

Xiaoxiong Gu, Young H. Kwark, Dazhao Liu, Yaojiang Zhang, Jun Fan, Renato Rimolo-Donadio, Sebastian Müller, Christian Schuster, Francesco de Paulis

Backplane Channel Design Optimization: Recasting a 3Gb/s Link to Operate at 25Gb/s and Above Inproceedings

UBM DesignCon Conference, Santa Clara, CA, USA, January 30-February 2, 2012.

Xiaomin Duan, Renato Rimolo-Donadio, Sebastian Müller, Kijan Han, Xiaoxiong Gu, Young H. Kwark, Heinz-Dietrich Brüns, Christian Schuster

Impact of Multiple Scattering on Passivity of Equivalent-Circuit Via Models Inproceedings

IEEE Electrical Design of Advanced Package & Systems Symposium (EDAPS), Hangzhou, China, December 12-14, 2011.

Links

Sebastian Müller, Xiaomin Duan, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Recent Developments of Via and Return Current Path Modeling (Invited) Inproceedings

International Conference on Electromagnetics in Advanced Applications (ICEAA), Torino, Italy, September 12-16, 2011.

Xiaomin Duan, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

A Hybrid CIM/MoM Approach for Power Plane Analysis Including Radiation Loss Inproceedings

Asia-Pacific EMC Symposium (APEMC), Jeju Island, Korea, May-16-19, 2011.

Renato Rimolo-Donadio, Thomas-Michael Winkel, Claudio Siviero, Dierk Kaller, Hubert Harrer, Heinz-Dietrich Brüns, Christian Schuster

Fast Parametric Pre-Layout Analysis of Signal Integrity for Backplane Interconnects Workshop

IEEE Workshop on Signal Propagation on Interconnects (SPI), Naples, Italy, May 8-11, 2011.

Links

Xiaoxiong Gu, Young H. Kwark, Yaojiang Zhang, Jun Fan, Albert Ruehli, Miroslav Kotzev, Sebastian Müller, Renato Rimolo-Donadio, Christian Schuster, Bruce Archambeault

Validation and Application of Physics-based Via Models to Dense Via Arrays Inproceedings

IEC DesignCon Conference, Santa Clara, USA, January 31-February 3, 2011.

Renato Rimolo-Donadio

Development, Validation, and Application of Semi-analytical Interconnect Models for Efficient Simulation of Multilayer Substrates PhD Thesis

2011, ISBN: 978-3-8325-2776-1 .

Sebastian Müller, Xiaomin Duan, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Non-Uniform Currents on Vias and Their Effects in a Parallel-Plate Environment Inproceedings

IEEE Electrical Design of Advanced Package & Systems Symposium (EDAPS), Singapore, December 7-9, 2010.

Links

Miroslav Kotzev, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Multiport Measurement and Deembedding Techniques for Crosstalk Study in Via Arrays Workshop

IEEE Workshop on Signal Propagation on Interconnects (SPI), Hildesheim, Germany, May 9-12, 2010.

Links

Sebastian Müller, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Effect of Mixed-Reference Planes on Single-Ended and Differential Links in Multilayer Substrates Workshop

IEEE Workshop on Signal Propagation on Interconnects (SPI), Hildesheim, Germany, May 9-12, 2010.

Links

Xiaomin Duan, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

A Combined Method for Fast Analysis of Signal Propagation, Ground Noise, and Radiated Emission of Multilayer Printed Circuit Boards Journal Article

IEEE Transactions on Electromagnetic Compatibility , 52 (2), 2010.

Links

Xiaomin Duan, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Fast and Concurrent Simulations for SI, PI, and EMI Analysis of Multilayer Printed Circuit Boards (invited) Inproceedings

Asia-Pacific Symposium on EMC (APEMC), Beijing, China, April 12-16, 2010.

Links

Sebastian Müller, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Schnelle Simulation verlustbehafteter Verbindungsstrukturen auf Leiterplatten auf der Grundlage quasianalytischer Via-Modelle und der Leitungstheorie Inproceedings

Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit (EMV Düsseldorf), Düsseldorf, Germany, March 9-11, 2010.

Xiaoxiong Gu, Renato Rimolo-Donadio, Zhenwei Yu, Francesco de Paulis, Young H. Kwark, Matteo Cocchini, Mark B. Ritter, Bruce Archambeault, Albert Ruehli, Jun Fan, Christian Schuster

Fast-Physics-Based Via and Trace Models for Signal and Power Integrity Co-Analysis Inproceedings

IEC DesignCon Conference, Santa Clara, USA, February 1-4, 2010.

Xiaomin Duan, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Bruce Archambeault, Christian Schuster

Special Session on Power Integrity Techniques: Contour Integral Method for Rapid Computation of Power/Ground Plane Impedance Inproceedings

IEC DesignCon Conference, Santa Clara, USA, February 1-4, 2010.

Renato Rimolo-Donadio, Xiaomin Duan, Heinz-Dietrich Brüns, Christian Schuster

Comprehensive Multilayer Substrate Models for Co-Simulation of Power and Signal Integrity Inproceedings

IMAPS 42th International Symposium on Microelectronics and Packaging, San Jose, California, USA, November 3-5, 2009.

Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Hybrid Approach for Efficient Calculation of the Parallel-Plate Impedance of Lossy Power/Ground Planes Journal Article

Microwave and Optical Technology Letters, 51 (9), 2009.

Links

Renato Rimolo-Donadio, Xiaoxiong Gu, Young H. Kwark, Mark B. Ritter, Bruce Archambeault, Francesco De Paulis, Yaojiang Zhang, Jun Fan, Heinz-Dietrich Brüns, Christian Schuster

Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures up to 40 GHz Journal Article

IEEE Transactions on Microwave Theory and Techniques, 57 (8), 2009.

Links

Renato Rimolo-Donadio, Xiaomin Duan, Heinz-Dietrich Brüns, Christian Schuster

Differential to Common Mode Conversion Due to Asymmetric Ground Via Configurations Workshop

IEEE Workshop on Signal Propagation on Interconnects (SPI), Strasbourg, France, May 12-15, 2009.

Links

Miroslav Kotzev, Renato Rimolo-Donadio, Christian Schuster

Extraction of Broadband Error Boxes for Microprobes and Recessed Probe Launches for Measurement of Printed Circuit Board Structures Workshop

IEEE Workshop on Signal Propagation on Interconnects (SPI), Strasbourg, France, May 12-15, 2009.

Links

Yaojiang Zhang, Renato Rimolo-Donadio, Christian Schuster, Erping Li, Jun Fan

Extraction of Via-Plate Capacitance of an Eccentric Via by an Integral Approximation Method Journal Article

IEEE Microwave and Wireless Components Letters, 19 (5), 2009.

Links

Dong Gun Kam, Mark B. Ritter, Troy J. Beukema, John F. Bulzacchelli, Petar K. Pepeljugoski, Young H. Kwark, Lei Shan, Xiaoxiong Gu, Christian W. Baks, Richard A. John, Gareth Hougham, Christian Schuster, Renato Rimolo-Donadio, Boping Wu

Is 25 Gb/s On-Board Signaling Viable? Journal Article

IEEE Transactions on Advanced Packaging, 32 (2), 2009.

Links

Miroslav Kotzev, Xiaoxiong Gu, Young H. Kwark, Mark B. Ritter, Renato Rimolo-Donadio, Christian Schuster

Bandwidth Study of Recessed Probe Launch Variations for Broadband Measurement of Embedded PCB Structures Inproceedings

German Microwave Conference (GeMic), Munich, Germany, March 16-18, 2009.

Links

Xiaoxiong Gu, Francesco De Paulis, Renato Rimolo-Donadio, Ketan Shringarpure, Yaojiang Zhang, Bruce Archambeault, Samuel Connor, Young H. Kwark, Mark B. Ritter, Jun Fan, Christian Schuster

Fully Analytical Methodology for Fast End-to-End Link Analysis on Complex Printed Circuit Boards including Signal and Power Integrity Effects. Inproceedings

IEC DesignCon Conference, Santa Clara, USA, February 2-5, 2009.

Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Including Stripline Connections into Network Parameter Based Via Models for Fast Simulation of Interconnects Inproceedings

International Zurich Symposium on Electromagnetic Compatibility, Switzerland, January 12-15, 2009.

Links

Mark B. Ritter, Petar K. Pepeljugoski, Xiaoxiong Gu, Young H. Kwark, Dong Gun Kam, Renato Rimolo-Donadio, Boping Wu, Christian W. Baks, Richard A. John, Lei Shan, Christian Schuster

The Viability of 25 Gb/s On-board Signaling Inproceedings

Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, USA, May 27-30, 2008.

Links

Renato Rimolo-Donadio, Andrzej J. Stepan, Heinz-Dietrich Brüns, James L. Drewniak, Christian Schuster

Simulation of Via Interconnects Using Physics-Based Models and Microwave Network Parameters Workshop

IEEE Workshop on Signal Propagation on Interconnects (SPI), Avignon, France, May 12-15, 2008.

Links

Renato Rimolo-Donadio, Christian Schuster, Young H. Kwark, Xiaoxiong Gu, Mark B. Ritter

Analysis and Optimization of the Recessed Probe Launch for High Frequency Measurements of PCB Interconnects Inproceedings

IEEE Design, Automation and Test in Europe Conference and Exhibition (DATE), Munich, Germany, March 10-14, 2008.

Links

Volker Vahrenholt, Heinz-Dietrich Brüns, Hermann Singer, Renato Rimolo-Donadio

Verkopplung einer schnellen PEEC-Methode mit der Momentenmethode bei gedruckten Schaltungen mittels der elektrischen Feldstärke Inproceedings

Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit (EMV Düsseldorf), Düsseldorf, Germany, February 18-21, 2008.