Functional Via-Structures in Ceramic Multilayered Substrates

„Low Temperature Cofired Ceramics“ (LTCC) is a technology that distinguishes itself from conventional technologies used for „Printed Circuit Boards“ (PCB) by means of a high permittivity, low dielectric losses and less manufacturing tolerances. LTCC technology is therefore especially useful for applications in microwave engineering and can allow for a high integration density of microwave devices and circuits due to the mechanical strength and high thermal conductivity of the material. To this end, via-structures (as opposed to microstrips) are supposed to be employed as functional elements for the design of filters, couplers and matching networks. That this can be an alternative to conventional methods using microstrips has already been shown and successfully applied for PCBs up to 20 GHz. This work is now to be extended to 70 GHz for use in LTCC multilayerd substrates. In doing so, established modeling techniques require to be adjusted and extended. Furthermore, appropriate testing structures will be designed as well as characterized using suitable measurement techniques.

 

Microwave probe tips and microstrip launch structure manufactured on 10 by 10 cm Low Temperature Cofired Ceramic (LTCC) substrate (Source: TET, TUHH).

Side view of two microwave probes for W-band measurements up to 110 GHz of substrate integrated waveguides on a Low Temperature Cofired Ceramic (LTCC) substrate (Source: TET, TUHH).

Funding: Freie und Hansestadt Hamburg
Contact: Ömer Faruk Yildiz, M.Sc.
Start date: 01.01.2017

Design of Passive Microwave Components on Multilayered Printed Circuit Boards Using Functional Vias

Ph.D. Thesis Andreas Hardock. 01.01.2011 – 31.03.2015

This thesis deals with the design of passive microwave components such as filters, couplers and matching networks using functional vias (plated through holes) on multilayered printed circuit boards. For this purpose, the otherwise parasitic wave effects associated with vias are carefully analyzed and used functionally. The design of the components was performed on theoretical and simulation level. Scattering parameters measurements up to 35 GHz are used for validation purposes. The designs are compared to common microwave components based on microstriplines. Advantages and disadvantages with regard to electric performance and area requirements are discussed.

Multilayer subsrate simulator developed at the the Institute of Electromagnetic Theory (Source: TET, TUHH).

Top-view of a via coupler designed on a 8-layer PCB  (Source: TET, TUHH).

Related Publications:

Andreas Hardock

Design of Passive Microwave Components on Multilayered Printed Circuit Boards using Functional Vias PhD Thesis

2016, ISBN: 978-3-8440-4615-1.

Qi Wu, Alexander Vogt, Jan Birger Preibisch, Andreas Hardock, Heinz-Dietrich Brüns, Christian Schuster

Modeling of Mutual Coupling between Coaxial Probes in Flat Metallic Casings Using the Contour Integral Method Inproceedings

2015 International Conference on Electromagnetics in Advanced Applications (ICEAA), Turin, Italy, September 07-11, 2015.

Links

Jan Birger Preibisch, Andreas Hardock, Christian Schuster

Physics-Based Via and Waveguide Models for Efficient SIW Simulations in Multilayer Substrates Journal Article

IEEE Transactions on Microwave Theory and Techniques , 63 (6), 2015.

Links

Andreas Hardock, David Dahl, Heinz-Dietrich Brüns, Christian Schuster

Efficient Calculation of External Fringing Capacitances for Physics-Based PCB Modeling Workshop

2015 IEEE 19th Workshop on Signal and Power Integrity (SPI), Berlin, Germany, May 10-13, 2015.

Links

Andreas Hardock, Heinz-Dietrich Brüns, Christian Schuster

Chebyshev Filter Design Using Vias as Quasi-Transmission Lines in Printed Circuit Boards Journal Article

IEEE Transactions on Microwave Theory and Techniques, 63 (3), 2015.

Links

Miroslav Kotzev, Young H. Kwark, Sebastian Müller, Andreas Hardock, Renato Rimolo-Donadio, Christian W. Baks, Christian Schuster

High Frequency Measurement Techniques for Vias in Printed Circuit Boards Journal Article

IEEE Electromagnetic Compatibility Magazine, 3 (4), 2014.

Links

Andreas Hardock, Young H. Kwark, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Using Via Stubs in Periodic Structures for Microwave Filter Design Journal Article

IEEE Transactions on Components, Packaging and Manufacturing Technology, 4 (7), 2014.

Links

Andreas Hardock, Renato Rimolo-Donadio, Sebastian Müller, Young H. Kwark, Christian Schuster

Signal integrity: Efficient, physics-based via modeling: Return path, impedance, and stub effect control Journal Article

IEEE Electromagnetic Compatibility Magazine, 3 (1), 2014.

Links

Andreas Hardock, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Application of Vias as Functional Elements in Microwave Coupling Structures Journal Article

IEEE Transactions on Microwave Theory and Techniques, 61 (10), 2013.

Links

Sebastian Müller, Andreas Hardock, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Analytical Extraction of Via Near-Field Coupling Using a Multiple Scattering Approach Workshop

EEE Workshop on Signal and Power Integrity (SPI) Paris, Frankreich, 2013.

Links

Andreas Hardock, Sebastian Müller, Xiaomin Duan, Heinz-Dietrich Brüns, Christian Schuster

Minimizing Displacement Return Currents in Multilayer Via Structures Inproceedings

IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Tempe, USA, October 21-24, 2012.

Links

Andreas Hardock, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Double Stub Matching in Multilayered Printed Circuit Board using Vias Inproceedings

Electronic Components and Technology Conference (ECTC), San Diego, USA, May 29-June 1, 2012.

Links

Probing and Fixturing Techniques for Wideband Multiport Measurements in Digital Packaging

Ph. D. Thesis Miroslav Kotzev. 01.10.2007 – 29.02.2013

This thesis deals with test signal probing and fixturing techniques for wideband multiport measurements in digital packaging in the frequency range from a few MHz to 50 GHz. Three different signal launch techniques are investigated in time and frequency domains. At first, the performance of the coaxial surface mounted connector launch is explored in case of crosstalk measurements in a backplane connector via pin field. In the next step the recessed probe launche technique is briefly presented. After that the main focus is on the results obtained in recent investigations with respect to the launch calibration, application to measurements of embedded mulitlayer structures and modifications to improve the launch bandwidth. Finally, the concept of a novel multiport probing fixture is presented and its electrical performance explored. Using a simple two-tier calibration procedure, the effect of the probing fixture on measurements of dense via array structures is reduced and the results obtained are validated with microprobe based measurements. Based on 3D full-wave electromagnetic modeling, suggestions for layout optimization are made which will be needed to extend the applicability of these techniques to data rates of 20 Gbit/s and beyond.

TUHH Universitätsbibliothek. TUBDok Link: http://doku.b.tu-harburg.de/volltexte/2013/1210/

12-port vector network analyzer from Agilent Technologies connected to backplane connector test vehicle (courtesy of IBM Development Böblingen,Germany)(Source: TET, TUHH).

Multiport probing measurement setup for investigations in dense via structures applying commercial microprobes and micropositioners (Source: TET, TUHH).

Related Publications:

Miroslav Kotzev

Probing and Fixturing Techniques for Wideband Multiport Measurements in Digital Packaging PhD Thesis

2013, ISBN: 978-3-8440-1910-0.

Miroslav Kotzev, Renato Rimolo-Donadio, Young H. Kwark, Christian W. Baks, Xiaoxiong Gu, Christian Schuster

Electrical Performance of the Recessed Probe Launch Technique for Measurement of Embedded Multilayer Structures Journal Article

IEEE Transactions on Instrumentation and Measurement, 61 (12), 2012.

Links

Miroslav Kotzev, Young H. Kwark, Christian W. Baks, Xiaoxiong Gu, Christian Schuster

Electrical Performance of a Multiport Interposer for Measurements of Dense Via Arrays Workshop

IEEE Workshop on Signal Propagation on Interconnects (SPI), Naples, Italy, May 8-11, 2011.

Links

Miroslav Kotzev, Christian Schuster

Custom-Made Calibration Standards for Measurements of Multilayer Substrates Inproceedings

German Microwave Conference (GeMic), Darmstadt, Germany, March 14-16, 2011.

Miroslav Kotzev, Heinz-Dietrich Brüns, Christian Schuster

Effect of Via Stubs on the TRL Calibration Technique for Measurement of Embedded Multilayer Structures Inproceedings

European Microwave Conference (EuMC), Paris, France, September 28-30, 2010.

Miroslav Kotzev, Roland Frech, Hubert Harrer, Dierk Kaller, Andreas Huber, Thomas-Michael Winkel, Heinz-Dietrich Brüns, Christian Schuster

Crosstalk Analysis in High Density Connector Via Pin Fields for Digital Backplane Applications Using a 12-Port Vector Network Analyzer Inproceedings

IEEE Conference of Electronics System Integration Technology (ESTC), Berlin, Germany, September 13-16, 2010.

Links

Miroslav Kotzev, Renato Rimolo-Donadio, Heinz-Dietrich Brüns, Christian Schuster

Multiport Measurement and Deembedding Techniques for Crosstalk Study in Via Arrays Workshop

IEEE Workshop on Signal Propagation on Interconnects (SPI), Hildesheim, Germany, May 9-12, 2010.

Links

Miroslav Kotzev, Renato Rimolo-Donadio, Christian Schuster

Extraction of Broadband Error Boxes for Microprobes and Recessed Probe Launches for Measurement of Printed Circuit Board Structures Workshop

IEEE Workshop on Signal Propagation on Interconnects (SPI), Strasbourg, France, May 12-15, 2009.

Links

Miroslav Kotzev, Xiaoxiong Gu, Young H. Kwark, Mark B. Ritter, Renato Rimolo-Donadio, Christian Schuster

Bandwidth Study of Recessed Probe Launch Variations for Broadband Measurement of Embedded PCB Structures Inproceedings

German Microwave Conference (GeMic), Munich, Germany, March 16-18, 2009.

Links